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Chen, Tuo-An
99  Ergebnisse:
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1

In-Memory Annealing Unit (IMAU): Energy-Efficient (2000 TOP..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Hong, Ming-Chun ; Cho, Le-Chih ; Lin, Chih-Sheng... - p. 21.3.1-21.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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2

Grandchild care and loneliness:

, In: Loneliness and Social Isolation in Old Age,
Tsai, Feng-jen ; Chen, Tuo-Yu - p. 76-85 , 2023
Link: https://doi.org/10.4324/..
 
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3

Research on Optimum Operating Parameters Selection of Activ..:

, In: 2019 IEEE International Conference on Signal Processing, Communications and Computing (ICSPCC),
Chen, Tuo ; Ma, Qiming ; Wang, Gongbing - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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4

Underwater Acoustic Object Discrimination for Few-Shot Lear..:

, In: 2019 4th International Conference on Mechanical, Control and Computer Engineering (ICMCCE),
Chen, Yuan ; Ma, QiMing ; Yu, Jie. - p. 430-4304 , 2019
Link: https://doi.org/10.1109/..
 
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5

Application of analytic hierarchy process (AHP) to evaluate..:

, In: 2016 International Conference on Management Science and Engineering (ICMSE),
Li, Tuo-chen ; Qiao, Lin - p. 1792-1797 , 2016
Link: https://doi.org/10.1109/..
 
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6

An extensible framework for application exception handling:

, In: The 2nd International Conference on Information Science and Engineering,
Wang, Meng ; Chen, Tuo ; Wan, Li. - p. 4354-4357 , 2010
Link: https://doi.org/10.1109/..
 
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7

Direction of Arrival Estimation Based on Improving Signal S..:

, In: 2019 IEEE International Conference on Signal Processing, Communications and Computing (ICSPCC),
Ye, Wang ; Tuo, Chen ; Chao, Sun - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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8

Trade-off Between Thermal Budget and Thickness Scaling: A B..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Chiu, Chui-Yi ; De, Sourav ; Cho, Chen-Yi. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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9

Perspective Roadmap of Advanced HfO2-based Ferroelectric Fi..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
De, Sourav ; Cho, Chen-Yi ; Ali, Tarek... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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10

U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Effici..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shih, Ching ; Hong, Ming-Chun ; Wang, Chih-Yao... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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11

Wake-Up of Ultrathin Ferroelectric Hf0.5Zr0.5O2: The Origin..:

, In: 2023 International Electron Devices Meeting (IEDM),
Cho, Chen-Yi ; Chao, Tzu-Yi ; Lin, Tzu-Yao... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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12

Guideline of Device Optimization for Ferroelectric InGaZnO ..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Chen, Yu-Hao ; Wang, I-Ting ; Zheng, Yue-Min. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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13

First BEOL-compatible, 10 ns-fast, and Durable 55 nm Top-pS..:

, In: 2023 International Electron Devices Meeting (IEDM),
Li, Kai-Shin ; Shieh, Jia-Min ; Chen, Yi-Ju... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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14

Design of High-RA STT-MRAM for Future Energy-Efficient In-M..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hong, Ming-Chun ; Su, Yi-Hui ; Chen, Guan-Long... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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15

U-MRAM: Transistor-Less, High-Speed (10 ns), Low-Voltage (0..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wu, Ming-Hung ; Hong, Ming-Chun ; Shih, Ching... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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