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2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
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Fea of Thermo-Mechanically Induced Cracks in IMD:
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2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
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Method of Scalable Polysilicon Resistor by Adjusting Shield..:
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2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems ,
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A study on inteference between 3D MEMS inductor and VCO:
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2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application ,
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Si Via Interconnection Technique with Thermal Budget Design:
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Lecture Notes in Computer Science; Computer Vision – ECCV 2022 Workshops ,
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Efficient and Accurate Quantized Image Super-Resolution on ..:
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2015 International Conference on Renewable Energy Research and Applications (ICRERA) ,
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Measurements and verification of ground-based LiDAR in comp..:
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Proceedings of the 2010 Summer Computer Simulation Conference ,
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Route reasoning-based mobility modeling and simulation for ..:
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2022 IEEE 5th International Conference on Image Processing Applications and Systems (IPAS) ,
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Cluster Analysis: Unsupervised Classification for Identifyi..:
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2024 IEEE 21st Biennial Conference on Electromagnetic Field Computation (CEFC) ,
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Study on High-Frequency Transformer with Variable Inductanc..:
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2023 IEEE Energy Conversion Congress and Exposition (ECCE) ,
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A Novel Method for Predicting the Leakage Inductance of the..:
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IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. ,
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Local-damascene-finFET DRAM integration with p/sup +/ doped..:
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2024 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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High Voltage DC-DC Converters with High Power Density Using..:
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Lessons from the ICU; Basic Ultrasound Skills "Head to Toe" for General Intensivists ,
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Assessment of Traumatic Acute Abdomen:
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Simple Chemical Methods for Thin Film Deposition ,
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