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Chia-Peng Yu
928  Ergebnisse:
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1

Characterization of Low Loss Dielectric Materials for High-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Tzu Nien ; Lau, John H ; Ko, Cheng-Ta... - p. 2222-2229 , 2022
Link: https://doi.org/10.1109/..
 
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2

A Novel Warpage Reinforcement Architecture with RDL Interpo..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Peng, Chia-Yu ; Lin, Puru Bruce ; Ko, Cheng-Ta... - p. 526-531 , 2020
Link: https://doi.org/10.1109/..
 
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3

Fan-Out RDL-first Panel-Level Packaging for Heterogeneous I..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Yang, Kai-Ming... - p. 339-347 , 2020
Link: https://doi.org/10.1109/..
 
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4

Fan-In Panel-Level with Multiple Diced Wafers Packaging:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Tseng, Tzvy-Jang... - p. 1146-1153 , 2020
Link: https://doi.org/10.1109/..
 
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5

The color demosaicing and image scaling based on improve Ha..:

, In: 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Peng, Yu-Wen ; Hu, Chia-Yu ; Chin, Yen-Ju... - p. 892-897 , 2023
Link: https://doi.org/10.1109/..
 
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6

Design and Implementation of Two-Stage Boost and FullBridge..:

, In: 2023 IEEE International Future Energy Electronics Conference (IFEEC),
Chen, Chia-Yu ; Liang, Tsorng-Juu ; Liao, Kuo-Fu... - p. 478-481 , 2023
Link: https://doi.org/10.1109/..
 
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7

A Wireless Urine Detection System and Platform with Power-E..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Lee, Shuenn-Yuh ; Lee, Hao-Yun ; Ciou, Ding-Siang... - p. 246-247 , 2022
Link: https://doi.org/10.1109/..
 
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8

Optimization of 2.2D Underfill Process by Novel Methodology..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sun, Chia-Peng ; Liang, Yu-En ; Hu, Dyi-Chung... - p. 175-180 , 2023
Link: https://doi.org/10.1109/..
 
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9

Advanced Optical Metrology for Stability Monitoring of Poly..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lin, Wen-Yi ; Yang, Kan-Ju ; Sun, Chia-Peng... - p. 159-162 , 2023
Link: https://doi.org/10.1109/..
 
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10

Integrated Circuit Packaging:

, In: Molding Simulation: Theory and Practice,
Hsu, Chih-Chung ; Sun, Chia-Peng ; Wang, Chen-An. - p. 549-593 , 2022
Link: https://doi.org/10.1007/..
 
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11

A Novel Modelling Methodology for Underfill Molding Process..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liang, Yu En ; Sun, Chia Peng ; Hsu, Chih Chung... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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12

A Novel Equivalent Model for Underfill Molding Process On 2..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liang, Yu En ; Sun, Chia Peng ; Hsu, Chih Chung... - p. 531-538 , 2022
Link: https://doi.org/10.1109/..
 
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13

Plasmon-Enhanced Solar-Driven Hydrogen Evolution Using Plas..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Peng, Tzu-Yu ; Yu, Meng-Ju ; Chang, Chih-Li... - p. 1-1 , 2022
Link: https://doi.org/10.1109/..
 
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14

Integrated Circuit Packaging:

, In: Molding Simulation: Theory and Practice,
Hsu, Chih-Chung (Jim) ; Sun, Chia-Peng (Victor) ; Wang, Chen-An (Jennan). - p. 549-593 , 2022
Link: https://doi.org/10.3139/..
 
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15

Ten-port Sub-6G antenna for 5G smartphone applications:

, In: 2020 9th Asia-Pacific Conference on Antennas and Propagation (APCAP),
Zhao, Yu-Chen ; Chen, I-Fong ; Peng, Chia-Mei. - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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