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2020 IEEE Symposium on VLSI Technology ,
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Low Temperature SoIC™ Bonding and Stacking Technology for 1..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Ultra High Density SoIC with Sub-micron Bond Pitch:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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SoIC for Low-Temperature, Multi-Layer 3D Memory Integration:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
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Integrated Deep Trench Capacitor in Si Interposer for CoWoS..:
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Proceedings of the Twentieth International Cryogenic Engineering Conference (ICEC20) ,
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Performance of a cryogenic system for the superconducting R..:
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Proceedings of the conference on European design automation ,
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Fully testable PLA design with minimal extra input:
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Intelligent Interactive Multimedia Systems and Services; Smart Innovation, Systems and Technologies ,
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A Novel Approach to Evaluating Multi-period Performance of ..:
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2011 16th International Solid-State Sensors, Actuators and Microsystems Conference ,
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A wireless and batteryless microsystem with implantable gri..:
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Environmentally Compatible Food Packaging ,
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Types, production and assessment of biobased food packaging..:
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2006 IEEE International Conference on Systems, Man and Cybernetics ,
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Kannon: Ubiquitous Sensor/Actuator Technologies for Elderly..:
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7th Joint MMM-Intermag Conference. Abstracts (Cat. No.98CH36275) ,
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