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Lecture Notes in Civil Engineering; ICSCEA 2019 ,
1
Tensile Behavior of Ultra-High-Ductile Fiber-Reinforced Cem..:
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2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) ,
3
Suspended Alumina Membrane for GA2O3 Gas Sensor with Enhanc..:
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2023 IEEE International Solid-State Circuits Conference (ISSCC) ,
4
28.7 A 1.1V 6.4Gb/s/pin 24-Gb DDR5 SDRAM with a Highly-Accu..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
5
22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarte..:
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Proceedings of 7th International Workshop on Enterprise networking and Computing in Healthcare Industry, 2005. HEALTHCOM 2005. ,
6
Development of the investigation scheduling system using mo..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
7
2.4 ATOMUS: A 5nm 32TFLOPS/128TOPS ML System-on-Chip for La..:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
8
Precise Prediction of Sustainable Operating Life of Tantalu..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
9
Development of Fine Pitch Backside Redistribution Layer (BR..:
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Proceedings of the 46th International ACM SIGIR Conference on Research and Development in Information Retrieval ,
10
NC2T: Novel Curriculum Learning Approaches for Cross-Prompt..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
11
A 1ynm 1.25V 8Gb, 16Gb/s/pin GDDR6-based Accelerator-in-Mem..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
12
Realization of high A/R and fine pitch Cu pillars incorpora..:
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2022 IEEE Hot Chips 34 Symposium (HCS) ,
13
System Architecture and Software Stack for GDDR6-AiM:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
14
14nm FinFET process technology platform for over 100M pixel..:
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2018 International Conference on Electronics, Information, and Communication (ICEIC) ,
15