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Choi, Jeong Il
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1

Tensile Behavior of Ultra-High-Ductile Fiber-Reinforced Cem..:

, In: Lecture Notes in Civil Engineering; ICSCEA 2019,
Nguyen, Huy Hoang ; Choi, Jeong-Il ; Park, Se-Eon. - p. 607-614 , 2020
Link: https://doi.org/10.1007/..
 
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2

Volume matting : object tracking based matting tool:

, In: ACM SIGGRAPH ASIA 2010 Posters,
Kim, Jaehwan ; Kim, Jae Hean ; Joo, Sang Hyun.. - p. 1 ff. , 2010
Link: https://dl.acm.org/doi/1..
 
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3

Suspended Alumina Membrane for GA2O3 Gas Sensor with Enhanc..:

, In: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS),
Jeong, Han-Il ; Choi, Gyujun ; Kim, Jongbaeg - p. 729-732 , 2020
Link: https://doi.org/10.1109/..
 
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4

28.7 A 1.1V 6.4Gb/s/pin 24-Gb DDR5 SDRAM with a Highly-Accu..:

, In: 2023 IEEE International Solid-State Circuits Conference (ISSCC),
Kwon, Daehyun ; Jeong, Heon Su ; Choi, Jaemin... - p. 27-29 , 2023
Link: https://doi.org/10.1109/..
 
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5

22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarte..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lee, Dong Uk ; Cho, Ho Sung ; Kim, Jihwan... - p. 334-336 , 2020
Link: https://doi.org/10.1109/..
 
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6

Development of the investigation scheduling system using mo..:

, In: Proceedings of 7th International Workshop on Enterprise networking and Computing in Healthcare Industry, 2005. HEALTHCOM 2005.,
Byeong-il Lee ; Jeong Min Ham ; Ki Soo Park... - p. 325,326 , 2005
Link: https://doi.org/10.1109/..
 
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7

2.4 ATOMUS: A 5nm 32TFLOPS/128TOPS ML System-on-Chip for La..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Yu, Chang-Hyo ; Kim, Hyo-Eun ; Shin, Sungho... - p. 42-44 , 2024
Link: https://doi.org/10.1109/..
 
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8

Precise Prediction of Sustainable Operating Life of Tantalu..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Min, Kwan-Il ; Jung, Yong ; Choi, Jae-Woong.. - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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9

Development of Fine Pitch Backside Redistribution Layer (BR..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lee, Hyunju ; Park, Sung Keun ; Jeong, Kwangok... - p. 515-519 , 2023
Link: https://doi.org/10.1109/..
 
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10

NC2T: Novel Curriculum Learning Approaches for Cross-Prompt..:

, In: Proceedings of the 46th International ACM SIGIR Conference on Research and Development in Information Retrieval,
Lee, Yejin ; Jeong, Seokwon ; Kim, Hongjin... - p. 2204-2208 , 2023
Link: https://dl.acm.org/doi/1..
 
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11

A 1ynm 1.25V 8Gb, 16Gb/s/pin GDDR6-based Accelerator-in-Mem..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Seongju ; Kim, Kyuyoung ; Oh, Sanghoon... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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12

Realization of high A/R and fine pitch Cu pillars incorpora..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Park, Se-Chul ; Park, Jong-Ho ; Bae, Seonghoon... - p. 1005-1009 , 2022
Link: https://doi.org/10.1109/..
 
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13

System Architecture and Software Stack for GDDR6-AiM:

, In: 2022 IEEE Hot Chips 34 Symposium (HCS),
Kwon, Yongkee ; Vladimir, Kornijcuk ; Kim, Nahsung... - p. 1-25 , 2022
Link: https://doi.org/10.1109/..
 
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14

14nm FinFET process technology platform for over 100M pixel..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Yu, Donghee ; Choi, Jong-Won ; Jung, Sangil... - p. 8.1.1-8.1.4 , 2019
Link: https://doi.org/10.1109/..
 
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15

LoRa based renewable energy monitoring system with open IoT..:

, In: 2018 International Conference on Electronics, Information, and Communication (ICEIC),
Choi, Chang-Sic ; Jeong, Jin-Doo ; Lee, Il-Woo. - p. 1-2 , 2018
Link: https://doi.org/10.23919..
 
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