Chu, Chen-Fu
1209  Ergebnisse:
Personensuche X
?
1

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
 
?
2

mmWave Antenna Design in Advanced Fan-Out Technology for 5G..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
?
3

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
 
?
4

Design and Evaluation of Mixed Reality Application for Hist..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Chu, Yen-Chen ; Lin, Che-Chun ; Fu, Kai-Li. - p. 172-174 , 2024
 
?
5

mmWave AiP Measurement Turnkey Solution in Millimeter-Wave ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hsieh, Sheng-Chi ; Chu, Fu-Cheng ; Ho, Cheng-Yu.. - p. 114-119 , 2020
 
?
6

Performance Analysis and Test Solution with Integrated Ante..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
?
7

UAV-Assisted Intelligent Traffic Diagnosis System Design:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Wang, Yu-Ying ; Huang, Chen-Wei ; Huang, Yi-Hua.. - p. 821-822 , 2023
 
?
8

Electrical Performance Analysis for Bridge Die Package Solu..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pan, Po Chih ; Chu, Fu Cheng ; Kuo, Hung Chun... - p. 113-114 , 2022
 
?
9

A prediction based energy conserving resources allocation s..:

, In: 2014 IEEE International Conference on Granular Computing (GrC),
Wang, Chu-Fu ; Hung, Wen-Yi ; Yang, Chen-Shun - p. 320-324 , 2014
 
?
10

Carbon/Nitrogen Dual-Doped inP-Type Silicon Hard Mask for W..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Yen-Shuo ; Chiu, Tzu Wei ; Fan, Hua-Tai... - p. 1-2 , 2024
 
?
11

Novel Single and Co-Ion Implantation Induced Backside Etch ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yen-Shuo ; Chiu, Tzu-Wei ; Fan, Hua-Tai... - p. 2184-2188 , 2024
 
?
13

Contributors:

, In: Graphene Bioelectronics,
 
?
14

Si Multi-Bridge Channel CMOS Inverter with Five Stacked Lay..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
?
15

List of contributors:

, In: Scale-up and Chemical Process for Microbial Production of Plant-Derived Bioactive Compounds,
Chen, Anqi ; Chen, Min ; Cheng, Cheng... - p. xi-xiv , 2024
 
1-15