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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Creative Design and Structure Applied to Chiplets Packaging:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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mmWave Antenna Design in Advanced Fan-Out Technology for 5G..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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High Speed D2D Interface Applied on Advanced Package:
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2024 10th International Conference on Applied System Innovation (ICASI) ,
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Design and Evaluation of Mixed Reality Application for Hist..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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mmWave AiP Measurement Turnkey Solution in Millimeter-Wave ..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
6
Performance Analysis and Test Solution with Integrated Ante..:
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2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
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UAV-Assisted Intelligent Traffic Diagnosis System Design:
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2022 International Conference on Electronics Packaging (ICEP) ,
8
Electrical Performance Analysis for Bridge Die Package Solu..:
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2014 IEEE International Conference on Granular Computing (GrC) ,
9
A prediction based energy conserving resources allocation s..:
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2024 International Conference on Electronics Packaging (ICEP) ,
10
Carbon/Nitrogen Dual-Doped inP-Type Silicon Hard Mask for W..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
11
Novel Single and Co-Ion Implantation Induced Backside Etch ..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
14
Si Multi-Bridge Channel CMOS Inverter with Five Stacked Lay..:
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Scale-up and Chemical Process for Microbial Production of Plant-Derived Bioactive Compounds ,
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