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Chung, Chao-Chin
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1

Social Media as Mechanism for Accountability: Cases of Chin..:

, In: Dismantling Cultural Borders Through Social Media and Digital Communications,
Xie, Ming ; Chao, Chin-Chung - p. 45-69 , 2022
Link: https://doi.org/10.1007/..
 
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2

Sidelobe Level Reduction in Uniform Planar Phased Arrays Th..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Huang, Chung-Hao ; Xu, Chao-Chin ; Lee, Jin-Cheng. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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3

When post-quantum cryptography meets the internet of things..:

, In: Proceedings of the 20th Annual International Conference on Mobile Systems, Applications and Services,
Chung, Chia-Chin ; Pai, Chu-Chi ; Ching, Fu-Shiang.. - p. 525-526 , 2022
Link: https://dl.acm.org/doi/1..
 
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4

Reconfiguring Computer-Generated Holographic Coding Pattern..:

, In: Proceedings of the Future Technologies Conference (FTC) 2018; Advances in Intelligent Systems and Computing,
Huang, Jen-Fa ; Liu, Chun-Chieh ; Yang, Chao-Chin. - p. 733-742 , 2018
Link: https://doi.org/10.1007/..
 
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5

NTIRE 2020 Challenge on NonHomogeneous Dehazing:

, In: 2020 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Ancuti, Codruta O. ; Ancuti, Cosmin ; Vasluianu, Florin-Alexandru... - p. 2029-2044 , 2020
Link: https://doi.org/10.1109/..
 
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6

Contributors:

, In: Handbook of Proteolytic Enzymes,
Abbott, Catherine Anne ; Abraham, Carmela R. ; Adachi, Hideki... - p. xxxv-xlviii , 2013
Link: https://doi.org/10.1016/..
 
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7

Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Chih-Chin ; Hsiao, Ching-Hung ; Chen, Yi-Che... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Common Source Line-to-Word Line Short Improvement by Elimin..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chung, Yao-An ; Chu, Yuan-Chieh ; Chang, Chih-Chin... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Machine learning Assists on High Aspect Ratio Slit Trench E..:

, In: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Yu-Fan ; Lee, Hong-Ji ; Chou, Fu-Hsing... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

Subjective Interpupillary Distance of Measurement Technique:

, In: 2019 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS),
Liao, Jih-Yi ; Chen, Der-Chin ; Chang, Shih-Tsung... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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11

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024
Link: https://doi.org/10.1109/..
 
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12

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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13

Evaluation of ORB-SLAM based Stereo Vision for the Aircraft..:

, In: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society,
Peng, Chao-Chung ; He, Rong ; Chuang, Chin-Sheng - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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14

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Zhang, Jie ; Lu, Wei ; Huang, Po-Tsang... - p. 262-263 , 2022
Link: https://doi.org/10.1109/..
 
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15

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
Link: https://doi.org/10.1109/..
 
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