Chung Yue Hui
175  Ergebnisse:
Personensuche X
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1

Contributors:

, In: Tea in Health and Disease Prevention,
Abbas, Sami ; AbouLaila, Mahmoud ; Acquas, Elio... - p. xvii-xxxviii , 2013
 
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2

The Socioemotional Wealth Effect on Intra-family Succession..:

, In: HCI in Business, Government and Organizations; Lecture Notes in Computer Science,
Chung, Pi Hui - p. 274-284 , 2023
 
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3

Experimenting with system and Libc call interception attack..:

, In: Proceedings of the 2011 ACM Symposium on Applied Computing,
 
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4

A 105-dB SFDR 16-bit SAR ADC with a Window Capacitor Calibr..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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A 10b 400MS/s 2x-Time-Interleaved 2-Then-1b/Cycle SAR ADC i..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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6

A 90-dB DR Discrete-Time Delta-Sigma Modulator for Audio Ap..:

, In: 2023 20th International SoC Design Conference (ISOCC),
 
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7

A 12-bit 100-kS/s SAR ADC for IoT Applications:

, In: 2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT),
Chung, Yung-Hui ; Zeng, Qi-Feng - p. 1-4 , 2020
 
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8

Tuning of Servo Drive Controller Based on Boosted Tree Mode..:

, In: 2020 23rd International Conference on Electrical Machines and Systems (ICEMS),
Chen, Chi-Wen ; Chang, Lien-Kai ; Liao, Yi-Ting... - p. 107-110 , 2020
 
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A 102dB-SFDR 16-bit Calibration-Free SAR ADC in 180-nm CMOS:

, In: 2019 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS),
 
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10

A High-Performance AWG-based Optical WDM Two-SubRing Networ:

, In: 2019 4th International Conference on Intelligent Green Building and Smart Grid (IGBSG),
 
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11

A 12-bit Domino ADC with a Background Offset Calibration Sc..:

, In: 2019 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS),
Chung, Yung-Hui - p. 9-12 , 2019
 
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12

The Phenomenon of Tunnel Structure Mold Flowability Experim..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lo, Shih Kun ; Su, Yi Hsun ; Li, Zong Yuan... - p. 764-769 , 2023
 
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13

Simulation of Solder Crack Phenomenon in Molding Process:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chien, Tzu Chieh ; Li, Zong Yuan ; Lo, Shih Kun... - p. 1959-1963 , 2023
 
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Optimization of Process Parameters for Molding Simulation o..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lo, Shih Kun ; Jian, Ting Yu ; Li, Zong Yuan... - p. 655-659 , 2022
 
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Simulation of the Filler Stuck Mechanism in Molding Process..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chien, Tzu Chieh ; Lo, Shih Kun ; Kuo, Yen Hua... - p. 1798-1804 , 2022
 
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