E. Dupuy
16  Ergebnisse:
Personensuche X
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1

Nanosheet-based Complementary Field-Effect Transistors (CFE..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Mertens, H. ; Hosseini, M. ; Chiarella, T.... - p. 1-2 , 2023
 
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2

FinFETs with Thermally Stable RMG Gate Stack for Future DRA..:

, In: 2022 International Electron Devices Meeting (IEDM),
Capogreco, E. ; Arimura, H. ; Ritzenthaler, R.... - p. 26.2.1-26.2.4 , 2022
 
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3

Forksheet FETs with Bottom Dielectric Isolation, Self-Align..:

, In: 2022 International Electron Devices Meeting (IEDM),
Mertens, H. ; Ritzenthaler, R. ; Oniki, Y.... - p. 23.1.1-23.1.4 , 2022
 
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4

High Performance Thermally Resistant FinFETs DRAM Periphera..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Ritzenthaler, R. ; Capogreco, E. ; Dupuy, E.... - p. 306-307 , 2022
 
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5

Scaled FinFETs Connected by Using Both Wafer Sides for Rout..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Veloso, A. ; Jourdain, A. ; Radisic, D.... - p. 284-285 , 2022
 
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6

Scaled transistors with 2D materials from the 300mm fab:

, In: 2020 IEEE Silicon Nanoelectronics Workshop (SNW),
Asselberghs, I. ; Schram, T. ; Smets, Q.... - p. 67-68 , 2020
 
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7

Buried Power Rail Integration with Si FinFETs for CMOS Scal..:

, In: 2020 IEEE Symposium on VLSI Technology,
Gupta, A. ; Mertens, H. ; Tao, Z.... - p. 1-2 , 2020
 
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8

Impact of Fin Height on Bias Temperature Instability of Mem..:

, In: 2019 IEEE International Integrated Reliability Workshop (IIRW),
 
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9

BioFET Technology: Aggressively Scaled pMOS FinFET as Biose..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Martens, K. ; Vos, R. ; Stakenborg, T.... - p. 18.6.1-18.6.4 , 2019
 
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13

Three-dimensional gradient-index optics via injketaided add..:

, In: 2015 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting,
 
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14

The Challenge of "Proliferation": An Anatomy of the Debate:

, In: The Oxford handbook of international adjudication / Cesare Romano ed. ...
 
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15

Integration of multi-level self-aligned CoWP barrier compat..:

, In: 2006 International Interconnect Technology Conference,
Chhun, S. ; Margain, A. ; Guillan, J.... - p. 33-35 , 2006
 
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