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El-Helou, Assaad
6  Ergebnisse:
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1

SiC structural characterization by non destructive near-fie..:

, In: 2022 International Semiconductor Conference (CAS),
Wu, Kuan-Ting ; Vuillermet, Enora ; Usureau, Elise... - p. 73-76 , 2022
Link: https://doi.org/10.1109/..
 
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2

PCB Layout for Chip-Scale Package GaN Fets Optimizes Both E..:

, In: 2022 IEEE Applied Power Electronics Conference and Exposition (APEC),
Glaser, John S. ; Helou, Assaad - p. 991-998 , 2022
Link: https://doi.org/10.1109/..
 
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3

High Resolution Thermoreflectance Imaging and Numerical Mod..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
El Helou, Assaad ; Cui, Yubo ; Tadjer, Marko.. - p. 192-195 , 2020
Link: https://doi.org/10.1109/..
 
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4

Assessment of CMP Fill Pattern Effect on the Thermal Perfor..:

, In: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC),
El Helou, Assaad ; Venugopal, Archana ; Raad, Peter E. - p. 405-409 , 2019
Link: https://doi.org/10.1109/..
 
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5

Full 3D Thermal Simulation of GaN HEMT using Ultra-Fast Sel..:

, In: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Helou, Assaad El ; Tadjer, Marko J. ; Hobart, Karl D.. - p. 1-3 , 2018
Link: https://doi.org/10.1109/..
 
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6

Temperature dependence of the thermoreflectance coefficient..:

, In: 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),
El Helou, Assaad ; Raad, Peter E. ; Komarov, Pavel - p. 161-164 , 2018
Link: https://doi.org/10.1109/..
 
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