Fukuda, Minoru
6  Ergebnisse:
Personensuche X
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1

Development of Next-Generation Distortion Correction Techno..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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2

50 nm Overlay Accuracy for Wafer-to-wafer Bonding by High-p..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Mitsuishi, Hajime ; Mori, Hiroshi ; Maeda, Hidehiro... - p. 1664-1671 , 2023
 
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3

Demonstration of 50 nm Overlay Accuracy for Wafer-to-Wafer ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mitsuishi, Hajime ; Mori, Hiroshi ; Maeda, Hidehiro... - p. 338-343 , 2022
 
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4

Leukosialin, a Major Sialoglycoprotein Defining Leucocyte D..:

, In: Ciba Foundation Symposium 145 - Carbohydrate Recognition in Cellular Function; Novartis Foundation Symposia,
Fukuda, Minoru - p. 257-282 , 2007
 
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5

Measurement of Three-Dimensional Force Applied to Elastic S..:

, In: 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC),
Fukuda, Kohei ; Kawasetsu, Takumi ; Ishihara, Hisashi... - p. 7140-7144 , 2019
 
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