Gong, Meng-Dan
245  Ergebnisse:
Personensuche X
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Contributors:

, In: Stimulated Raman Scattering Microscopy,
 
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Facial expression recognition using geometric and appearanc..:

, In: Proceedings of the 4th International Conference on Internet Multimedia Computing and Service,
Chen, Jingying ; Chen, Dan ; Gong, Yujiao... - p. 29-33 , 2012
 
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Research on dynamic evolvement of desertification in beijin..:

, In: 2007 IEEE International Geoscience and Remote Sensing Symposium,
Dan Meng ; Zhiqiang Zhang ; Tao Yang... - p. None , 2007
 
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Simulation Analysis of a New Type of Combined Double Jet No..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2020,
Meng, Qi ; Du, Gui-tao ; Zhu, Shao-gong... - p. 280-290 , 2021
 
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Denoising algorithm based on bilateral filtering and improv..:

, In: Proceedings of the International Conference on Artificial Intelligence, Information Processing and Cloud Computing,
Zheng, Xuan ; Fu, Bo ; Zhao, Xilin... - p. 1-5 , 2019
 
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Research on multidimensional classroom teaching mode in Int..:

, In: 2022 3rd International Conference on Education, Knowledge and Information Management (ICEKIM),
Wang, Jianing ; Gong, Dan ; Sun, Lurong. - p. 343-346 , 2022
 
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Electrical metrology based on quantum technology: a review ..:

, In: 2022 IEEE 5th International Electrical and Energy Conference (CIEEC),
Wang, Siyun ; Duan, Meimei ; Xu, Qing... - p. 3062-3067 , 2022
 
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Effect of Shared Cavity on Electromechanical Performance of..:

, In: 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Wang, Weili ; Chiu, Yihsiang ; Gong, Dan... - p. 482-487 , 2019
 
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A Selective Mutation based Fault Localization Method and th..:

, In: Proceedings of the 2019 International Conference on Artificial Intelligence and Computer Science,
Gong, Dan ; Su, Xiaohong ; Wang, Tiantian - p. 600-605 , 2019
 
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Study on AlN micromachined ultrasonic transducer array with..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Gong, Dan ; Chiu, Yihsiang ; Ma, Shenglin.. - p. 1-5 , 2019
 
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Thermal resistance analysis for a high power 3D integrated ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hu, Xinxin ; Zhou, Bin ; Ma, Shenglin... - p. 406-412 , 2019
 
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Fabrication Process and Performance Analysis of AlN based P..:

, In: 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Wang, Li ; Chiu, Yihsiang ; Gong, Dan... - p. 514-519 , 2019
 
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Thermal Effect of PMUT and Its Application to the Heat Diss..:

, In: 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Li, Nan ; Chiu, Yihsiang ; Gong, Dan... - p. 540-544 , 2019
 
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An Indirect State-of-Health Estimation Method for Lithium-I..:

, In: Communications in Computer and Information Science; Artificial Intelligence and Robotics,
Zhang, Zhiying ; Meng, Gong ; Wang, Shenhang.. - p. 198-211 , 2024
 
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