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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Investigation on Underfill Properties Effect on Board Level..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
2
Effect of Printed Circuit Board Design Parameters on Solder..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
3
Partial Underfill Impact Study on Solder Joint Reliability ..:
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2007 IEEE International Geoscience and Remote Sensing Symposium ,
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Disaster monitoring and environmental alert in taiwan by re..:
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2007 IEEE International Geoscience and Remote Sensing Symposium ,
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Disaster monitoring and environmental alert in Taiwan by re..:
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2023 IEEE 23rd International Conference on Communication Technology (ICCT) ,
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Vehicle-Mounted Road Damage Detection Method Using YOLOv5s ..:
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2023 Winter Simulation Conference (WSC) ,
7
Virtual Wearable Sensor Data Generation with Generative Adv..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
8
Design Optimization to Boost Solder Joint Reliability Perfo..:
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2023 7th International Conference on Transportation Information and Safety (ICTIS) ,
9
Collision Risk Hotspot Identification Based on AIS Data and..:
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2023 Winter Simulation Conference (WSC) ,
10
An Intelligent Framework to Maximize Individual Taxi Driver..:
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Stereoscopic Anatomical Atlas of Ear Surgery ,
11
Stereoscopic Virtual Anatomy of Temporal Bone:
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Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; e-Learning, e-Education, and Online Training ,
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The Reform of Data Structure Course of MOOC + SPOC Diversif..:
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2017 IEEE International Electron Devices Meeting (IEDM) ,
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