Guo, Chunbing
15  Ergebnisse:
Personensuche X
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1

A Dual-Core Quad_Mode VCO with Reconfigurable Magnetic Coup..:

, In: 2023 IEEE 15th International Conference on ASIC (ASICON),
Kong, Xiangjian ; Qiu, Ding ; Jian, Mingchao.. - p. 1-4 , 2023
 
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2

A 180µW Dynamic Zoom ADC With 110 dB SNDR in 2 kHz BW:

, In: 2023 IEEE MTT-S International Wireless Symposium (IWS),
Ma, Tianfu ; Yuan, Meng ; Wang, Zhengyv.. - p. 1-3 , 2023
 
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3

A 100MS/s 12 Bit SAR-assisted Pipeline ADC with Gain-enhanc..:

, In: 2023 IEEE MTT-S International Wireless Symposium (IWS),
Fu, Yecong ; Jian, Mingchao ; Zheng, Jiwei. - p. 1-3 , 2023
 
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4

A 39 GHz Antenna-in-Package Deign Based on Multi-Layer Liqu..:

, In: 2022 IEEE 10th Asia-Pacific Conference on Antennas and Propagation (APCAP),
Du, Zhi-Xia ; Tang, Bintao ; Guo, Chunbing... - p. 1-2 , 2022
 
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5

Design and Optimization of Microchannel in a Fan-out Packag..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sun, Bo ; Zhang, Weize ; Guo, Chunbing. - p. 885-889 , 2022
 
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6

Design of an Extended Continuous Class-F Mode Power Amplifi..:

, In: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
Lin, Xin ; Du, Zhi-Xia ; Yan, Jiashu... - p. 1-3 , 2022
 
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7

Omnidirectional Circularly Polarized Antenna Based on Twin ..:

, In: 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT),
Zhu, Hongbo ; Zeng, Ziming ; Chen, Zhuozhu... - p. 1-3 , 2022
 
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8

An Outphasing Power Amplifier Based on Voltage-Current Comb..:

, In: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
Yan, Jiashu ; Du, Zhi-Xia ; Lin, Xin... - p. 1-3 , 2022
 
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9

A GaN-on-Si based Diplexer for 5G Millimeter-Wave Applicati..:

, In: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
Xie, Peiyan ; Du, Zhi-Xia ; Chen, Zhuozhu... - p. 1-3 , 2022
 
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10

A TGV-based Antenna in Package for 5G mm-Wave Application:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Xu, Sha ; Shi, Dianyang ; Guo, Chunbing - p. 1-4 , 2021
 
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11

An Antenna in Package for 5G mmWave Application:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Chen, Zebin ; Zhang, Jun ; Chen, Zhuozhu... - p. 1-3 , 2020
 
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12

A Reliability Assessment Approach for The Biomimetic Neuron..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Sun, Bo ; Lei, Ziquan ; Guo, Chunbing. - p. 1-4 , 2020
 
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13

Impact of Parasitic Capacitance on Neuromorphic Neuron Circ..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Sun, Bo ; Lei, Ziquan ; Li, Jiayi. - p. 1-4 , 2020
 
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14

A Method of ADC Circuit Noise Optimization based on A Stoch..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Ying, Zhang ; Bo, Sun ; Chunbing, Guo - p. 1-5 , 2023
 
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15

A Reliability Assessment Approach for GaN-Based Power Suppl:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Jinghao, Liang ; Bo, Sun ; Chunbing, Guo. - p. 1-5 , 2022
 
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