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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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Intel PowerVia Technology: Backside Power Delivery for High..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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E-Core Implementation in Intel 4 with PowerVia (Backside Po..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
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Reliability Modeling of Middle-Of-Line Interconnect Dielect..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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Novel Cell Architectures with Back-side Transistor Contacts..:
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2023 International Electron Devices Meeting (IEDM) ,
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Process Innovations for Future Technology Nodes with Back-S..:
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2022 IEEE International Conference on Plasma Science (ICOPS) ,
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Understanding Effects of Operating Parameters on Plasma Cat..:
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2020 IEEE International Reliability Physics Symposium (IRPS) ,
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Modeling Framework for Transistor Aging Playback in Advance..:
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2020 IEEE International Reliability Physics Symposium (IRPS) ,
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Reliability Characteristics of a High Density Metal- Insula..:
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2007 IEEE International Electron Devices Meeting ,
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A 45nm Logic Technology with High-k+Metal Gate Transistors,..:
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The IEE Seminar on Railway System Modelling - Not Just for Fun, 2004. ,
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Performance modelling for the National ERTMS Programme (NEP:
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Telemedicine and Teledermatology; Current Problems in Dermatology ,
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3.2. Satisfaction of Paramedical Personnel:
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Proceedings IEEE Virtual Reality (Cat. No. 99CB36316) ,
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A review of tele-immersive applications in the CAVE researc..:
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Proceedings of the 19th ACM Asia Conference on Computer and Communications Security ,
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SRAM Imprinting for System Protection and Differentiation:
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2024 IEEE Security and Privacy Workshops (SPW) ,
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Mitigating Deep Reinforcement Learning Backdoors in the Neu..:
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2024 International Conference on Machine Intelligence for GeoAnalytics and Remote Sensing (MIGARS) ,
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