Personensuche
X
?
2024 18th European Conference on Antennas and Propagation (EuCAP) ,
1
Conceptual Design and Propagation Characteristics of an Und..:
, In:
?
2024 IEEE International Conference on Consumer Electronics (ICCE) ,
2
Anticipatory Robot Navigation: Incorporating Estimated Obst..:
, In:
?
2024 16th International Conference on Computer and Automation Engineering (ICCAE) ,
3
Fake Obstacle Generation-based Pallet Alignment for Forklif..:
, In:
?
2024 IEEE International Conference on Consumer Electronics (ICCE) ,
4
Prediction of moving obstacles utilizing edge-cloud coopera..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
5
Low-Temperature and Low-Pressure Fine-Pitch Micro Cu Bump B..:
, In:
?
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
6
20 µm Copper Micro-Bump Bonding Through a Silver Metallizat..:
, In:
?
New Frontiers in Regional Science: Asian Perspectives; The Social City ,
7
Mobile Communications in Japan:
, In:
?
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI) ,
8
A High-Efficiency Underwater Dipole Antenna With Spherical ..:
, In:
?
IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society ,
9
Components and Basic Evaluation of Earthworm-Type Ice-Drill..:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
10
Effect of Ni additive on electroless Cu quality for high de..:
, In:
?
2023 21st International Conference on Advanced Robotics (ICAR) ,
11
Online Stochastic Model Identification for Safe and Accurat..:
, In:
?
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI) ,
12
Field Experiment of a Circularly Polarized Underwater Anten..:
, In:
?
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
13
Two-Dimensionally Arranged Display Drivers Achieved by OS/S..:
, In:
?
2023 IEEE Underwater Technology (UT) ,
14
Ocean Bottom Detector: frontier of technology for understan..:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
15