Hiroshi Yoshida
136  Ergebnisse:
Personensuche X
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1

Conceptual Design and Propagation Characteristics of an Und..:

, In: 2024 18th European Conference on Antennas and Propagation (EuCAP),
 
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2

Anticipatory Robot Navigation: Incorporating Estimated Obst..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
Liu, Fengkai ; Ohsita, Yuichi ; Kashima, Kenji... - p. 1-6 , 2024
 
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3

Fake Obstacle Generation-based Pallet Alignment for Forklif..:

, In: 2024 16th International Conference on Computer and Automation Engineering (ICCAE),
Bhat, Akhilesh ; Kai, Natsuki ; Suzuki, Takayuki.. - p. 676-680 , 2024
 
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4

Prediction of moving obstacles utilizing edge-cloud coopera..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
 
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5

Low-Temperature and Low-Pressure Fine-Pitch Micro Cu Bump B..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhang, Zheng ; Suetake, Aiji ; Liu, Ran... - p. 311-312 , 2024
 
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6

20 µm Copper Micro-Bump Bonding Through a Silver Metallizat..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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7

Mobile Communications in Japan:

, In: New Frontiers in Regional Science: Asian Perspectives; The Social City,
Kawahara, Yasuhiro ; Yoshida, Hiroshi - p. 121-131 , 2023
 
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8

A High-Efficiency Underwater Dipole Antenna With Spherical ..:

, In: 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI),
Kawamura, Takashi ; Matsushita, Takuma ; Kaneko, Yukio... - p. 1059-1060 , 2023
 
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9

Components and Basic Evaluation of Earthworm-Type Ice-Drill..:

, In: IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society,
 
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10

Effect of Ni additive on electroless Cu quality for high de..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
 
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11

Online Stochastic Model Identification for Safe and Accurat..:

, In: 2023 21st International Conference on Advanced Robotics (ICAR),
 
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12

Field Experiment of a Circularly Polarized Underwater Anten..:

, In: 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI),
 
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13

Two-Dimensionally Arranged Display Drivers Achieved by OS/S..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Komura, Yusuke ; Miyata, Shoki ; Okamoto, Yuki... - p. 1-2 , 2023
 
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15

Study of Cu Micro-via by TOF-SIMS and STEM:

, In: 2023 International Conference on Electronics Packaging (ICEP),
 
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