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Hsiao, Yu-Chan
399  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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List of Contributors:

, In: Chemical Engineering Process Simulation,
Ai, Zi Jie ; Chan, Joanne W.R. ; Chemmangattuvalappil, Nishanth... - p. xv , 2017
Link: https://doi.org/10.1016/..
 
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Contributors:

, In: Tea in Health and Disease Prevention,
Abbas, Sami ; AbouLaila, Mahmoud ; Acquas, Elio... - p. xvii-xxxviii , 2013
Link: https://doi.org/10.1016/..
 
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3

TUIC : enabling tangible interaction on capacitive multi..:

, In: Proceedings of the SIGCHI Conference on Human Factors in Computing Systems,
Yu, Neng-Hao ; Chan, Li-Wei ; Lau, Seng Yong... - p. 2995-3004 , 2011
Link: https://dl.acm.org/doi/1..
 
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4

Scene Novelty Prediction from Unsupervised Discriminative F..:

, In: 2020 IEEE 23rd International Conference on Intelligent Transportation Systems (ITSC),
Ranjbar, Arian ; Yeh, Chun-Hsiao ; Hornauer, Sascha.. - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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5

The preliminary study of improving the DPTNet speech enhanc..:

, In: 2022 8th International Conference on Applied System Innovation (ICASI),
Hsiao, Yu-Yu ; Wu, Ming-Hsuan ; Tsai, Kuan-Yu. - p. 64-67 , 2022
Link: https://doi.org/10.1109/..
 
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6

An Advanced Packaging Figure of Merit (AP-FoM) for Benchmar..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Chuei-Tang ; Shang, Shu-An ; Hsiao, Yu-Ming... - p. 1093-1097 , 2024
Link: https://doi.org/10.1109/..
 
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7

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
Link: https://doi.org/10.1109/..
 
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8

A Novel Gate Driver with Charge Sharing Technique to Optimi..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Hsiao, Yu-Sheng ; Yu, Wei-Chen ; Sung, Cheng... - p. 184-187 , 2024
Link: https://doi.org/10.1109/..
 
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9

A Special Holding System for Large Package in 3D X-Ray Insp..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Chia-Ju ; Hsiao, Yu-Hsiang ; Lin, Yi-Sheng. - p. 231-232 , 2024
Link: https://doi.org/10.23919..
 
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10

Micro-Defect Failure Analysis in Fan-Out Package and Corres..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chang, Yu-Jen ; Hsiao, Yu-Hsiang ; Lin, Yi-Sheng. - p. 327-329 , 2023
Link: https://doi.org/10.1109/..
 
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11

Lock-in Thermography judgment for short/leakage/high resist..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lin, Yu-Ting ; Liu, Cheng-Hsin ; Lin, Yi-Sheng. - p. 346-349 , 2023
Link: https://doi.org/10.1109/..
 
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12

When AI Meets AI - Artificial Intelligence Competition:

, In: 2023 11th International Conference on Information and Education Technology (ICIET),
Chen, Rain ; Hsiao, Yu-Chin ; Yang, Mei-Wei - p. 497-501 , 2023
Link: https://doi.org/10.1109/..
 
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13

A Method of Evaluating User Preference Similarity for Desti..:

, In: 2023 14th IIAI International Congress on Advanced Applied Informatics (IIAI-AAI),
Hsiao, Yu-Hsiang ; Hung, Pei-Yi - p. 452-455 , 2023
Link: https://doi.org/10.1109/..
 
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14

MAVFI: An End-to-End Fault Analysis Framework with Anomaly ..:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Hsiao, Yu-Shun ; Wan, Zishen ; Jia, Tianyu... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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15

VaPr: Variable-Precision Tensors to Accelerate Robot Motion..:

, In: 2023 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS),
Hsiao, Yu-Shun ; Sastry Hari, Siva Kumar ; Sundaralingam, Balakumar... - p. 6304-6309 , 2023
Link: https://doi.org/10.1109/..
 
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