Hsieh, C.
187  Ergebnisse:
Personensuche X
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1

Next Generation Large Size High Interconnect Density CoWoS-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Chien-Hsun ; Hu, YH ; Chen, SM... - p. 259-263 , 2024
 
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2

First Demonstration of Defect Elimination for Cryogenic Ge ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Yu, X.-R. ; Hsieh, C.-C. ; Chuang, M.-H.... - p. 1-4 , 2023
 
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3

An approach to embedding traditional non-volatile memories ..:

, In: 2020 IEEE Symposium on VLSI Technology,
Lin, C. S. ; Huang, W.T. ; Huang, Allan... - p. 1-2 , 2020
 
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4

Contributor contact details:

, In: Postharvest Biology and Technology of Tropical and Subtropical Fruits,
Ketsa, S. ; Paull, R.E. ; Saltveit, M.E.... - p. xv-xxi , 2011
 
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5

Microprocessor power analysis by labeled simulation:

, In: Proceedings of the conference on Design, automation and test in Europe,
Hsieh, C. ; Chen, L. ; Pedram, M. - p. 182-189 , 2001
 
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6

Floating body effects in partially-depleted SOI CMOS circui..:

, In: Proceedings of the 1996 international symposium on Low power electronics and design,
Lu, P. ; Ji, J. ; Chuang, C.... - p. 139-144 , 1996
 
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7

List of contributors:

, In: Translational Radiation Oncology,
Aaron, Daniel ; Abrams, Ross A. ; Agarwal, Mohit S.... - p. xi-xvi , 2023
 
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8

Critical Process Features Enabling Aggressive Contacted Gat..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chang, Chih-Hao ; Chang, V.S. ; Pan, K.H.... - p. 27.1.1-27.1.4 , 2022
 
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9

A 3nm CMOS FinFlex™ Platform Technology with Enhanced Power..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wu, Shien-Yang ; Chang, C.H. ; Chiang, M.C.... - p. 27.5.1-27.5.4 , 2022
 
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10

Quick travel planning and travel book editing system:

, In: Proceedings of the 4th Multidisciplinary International Social Networks Conference,
Hsieh, C. Y. ; Chen, P. B. ; Zeng, J. J.... - p. 1-4 , 2017
 
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13

Contributors:

, In: Current Clinical Medicine,
Abdelmalak, Joseph B. ; Abelson, Abby ; Absi, Ahmed... - p. vii-viii , 2010
 
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14

High performance 22/20nm FinFET CMOS devices with advanced ..:

, In: 2010 International Electron Devices Meeting,
Wu, C.C. ; Cheng, M.L. ; Li, T.H.... - p. 27.1.1-27.1.4 , 2010
 
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15

Application of super-fine ink-jet printer to fabrication of..:

, In: 2009 34th International Conference on Infrared, Millimeter, and Terahertz Waves,
Kawabata, T. ; Takano, K. ; Hsieh, C. -F.... - p. None , 2009
 
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