Hsieh, Chao-Ho
149  Ergebnisse:
Personensuche X
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1

Dynamic IR-Drop Prediction of At-Speed Two-Vector Tests Usi..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wu, Yu-Tsung ; Liang, Zhe-Jia ; Hsieh, Chao-Ho... - p. 1-4 , 2024
 
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2

ML-Assisted VminBinning with Multiple Guard Bands for Low P..:

, In: 2022 IEEE International Test Conference (ITC),
Lin, Wei-Chen ; Chen, Chun ; Hsieh, Chao-Ho... - p. 213-218 , 2022
 
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3

Low-IR-Drop Test Pattern Regeneration Using A Fast Predicto:

, In: 2022 23rd International Symposium on Quality Electronic Design (ISQED),
Liu, Shi-Tang ; Chen, Jia-Xian ; Wu, Yu-Tsung... - p. 27-32 , 2022
 
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4

High Performance Antenna-in-Package with Test Socket for Mi..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Ho, Cheng-Yu ; Hsiao, Wen-Chun ; Hsieh, Sheng-Chi.. - p. 191-192 , 2024
 
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5

A Compact AiP with a Dual-Polarized 1x4 Antenna Array for 5..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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7

A Dual-Band Dual-Polarized 2×2 Antenna Array with Beamformi..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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8

Design of Dual-Band Antenna in Package with Steerable Beam ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
 
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9

A 22nm 832Kb Hybrid-Domain Floating-Point SRAM In-Memory-Co..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Wu, Ping-Chun ; Su, Jian-Wei ; Hong, Li-Yang... - p. 126-128 , 2023
 
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10

Integration of Foundry MIM Capacitor and OSAT Fan-Out RDL f..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Pao-Nan ; Hsieh, Yu-Chang ; Lo, Hung-Lun... - p. 1310-1315 , 2022
 
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11

Using Hybrid Deep Learning Model to Detect Anomaly Traffic ..:

, In: 2022 IEEE 11th Global Conference on Consumer Electronics (GCCE),
Su, Yi-Jen ; Kuo, Tso-Lin ; Hsieh, Shan-Hsiung... - p. 814-815 , 2022
 
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12

A 2x2 Broadband Dual-Polarized Antenna Array using AiP Tech..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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13

Low loss Interconnection Solutions of Chip-to-Antenna for M..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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14

Performance Analysis and Test Solution with Integrated Ante..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
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15

mmWave AiP Measurement Turnkey Solution in Millimeter-Wave ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hsieh, Sheng-Chi ; Chu, Fu-Cheng ; Ho, Cheng-Yu.. - p. 114-119 , 2020
 
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