Hsu, A.
4515  Ergebnisse:
Personensuche X
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1

Demonstration of a Multi-Level μA-Range Bulk Switching ReRA..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wu, Y. ; Cai, F. ; Thomas, L.... - p. 18.4.1-18.4.4 , 2022
 
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2

Epidural Abscess and Subdural Empyema:

, In: Pediatric Neurosurgery for Clinicians,
Tu, A. ; Hsu, J. ; Steinbok, P. - p. 693-711 , 2022
 
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3

An implantable batteryless wireless impedance sensor for ga..:

, In: 2010 IEEE MTT-S International Microwave Symposium,
Ativanichayaphong, T. ; Tang, S. ; Hsu, L.... - p. 1-1 , 2010
 
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4

Siemens Corporate Research and Technologies in Emerging Cou..:

, In: Industrielle Forschung und Entwicklung in Emerging Markets,
Achatz, R. ; Eberl, U. ; Gitsels, M.... - p. 45-66 , 2009
 
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5

Harvesting aware power management for sensor networks:

, In: 2006 43rd ACM/IEEE Design Automation Conference,
Kansal, A. ; Hsu, J. ; Srivastava, M.. - p. 651-656 , 2006
 
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7

Floating body effects in partially-depleted SOI CMOS circui..:

, In: Proceedings of the 1996 international symposium on Low power electronics and design,
Lu, P. ; Ji, J. ; Chuang, C.... - p. 139-144 , 1996
 
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8

A Comparison of Functional and Structural Partitioning:

, In: Proceedings of the 9th international symposium on System synthesis,
Vahid ; Le ; Hsu - p. 121 ff. , 1996
 
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9

Content-based browsing of video sequences:

, In: Proceedings of the second ACM international conference on Multimedia,
Arman, F. ; Depommier, R. ; Hsu, A.. - p. 97-103 , 1994
 
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10

A 32b CMOS single-chip RISC type processor:

, In: 1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers,
Marston, A. ; Burroughs, G. ; Chen, K.-C.... - p. 28,29 , 1987
 
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11

Modeling and analysis to two-echelon resource allocation st..:

, In: Proceedings of the 19th conference on Winter simulation,
Liu, S. S. ; Wang, J. ; Hsu, A. - p. 794-801 , 1987
 
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12

Enhanced Speed Estimation Based on 2D Object Detection and ..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
 
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13

Artificial Intelligence Model Interpreting Tools: SHAP, LIM..:

, In: Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence,
 
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14

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ma, Kai ; Bekiaris, Nikolaos ; Hsu, Ching-Hsiang... - p. 331-336 , 2024
 
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15

Designing a Secure and Scalable Service Model Using Blockch..:

, In: 2024 IEEE/CVF Winter Conference on Applications of Computer Vision Workshops (WACVW),
Hsu, Tse-Chuan ; Lu, Han-Sheng - p. 645-653 , 2024
 
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