E-LIB Suche - Ergebnisse für: Hsu, C.T.

1

Impact of Trapped Charge Vertical Loss and Lateral Migratio..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),

Liu, Y. H. ; Zhan, T. C. ; Yang, Y. S.... - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

2

Synchronization analysis in spiking pixel architecture-hard..:

, In: 2004 IEEE Region 10 Conference TENCON 2004.,

Lee, W.P. ; Hsu, C.T. ; Tsoi, C.Y... - p. 274,275,276,277 , 2004

Link: https://doi.org/10.1109/..

3

Process optimization for preventing boron-penetration using..:

, In: 1995 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers,

Sun, W.T. ; Chen, S.H. ; Lin, C.J... - p. 40,41,42,43 , 1995

Link: https://doi.org/10.1109/..

4

Chromosomal Evolution in Cell Populations:

, In: International Review of Cytology; International Review of Cytology Volume 12,

Hsu, T.C. - p. 69-161 , 1962

Link: https://doi.org/10.1016/..

5

Reversed Cyclic Tests of 1/13 Scale Cylindrical Concrete Co..:

, In: Concrete Structures in Earthquake,

Wu, Chiun-Lin ; Hsu, Thomas T. C. ; Chang, Che-Yu... - p. 131-149 , 2019

Link: https://doi.org/10.1007/..

6

$1.62\mu \mathrm{m}$ Global Shutter Quantum Dot Image Senso..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),

Steckel, J. S. ; Josse, E. ; Pattantyus-Abraham, A. G.... - p. 23.4.1-23.4.4 , 2021

Link: https://doi.org/10.1109/..

7

List of contributors:

, In: Shoulder and Elbow Trauma and its Complications,

Ahmad, C.S. ; Archdeacon, M.T. ; Barlow, J.D.... - p. xiii-xiv , 2015

Link: https://doi.org/10.1016/..

8

List of contributors:

, In: Welding and Joining of Advanced High Strength Steels (AHSS),

Biro, E. ; Chatterjee, S. ; Cretteur, L.... - p. ix , 2015

Link: https://doi.org/10.1016/..

9

Low voltage (1M) 1-Selector/1-STT-MRAM with ultra-low (1 pp..:

, In: 2023 International Electron Devices Meeting (IEDM),

Ambrosi, E. ; Wu, C. H. ; Song, M. Y.... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

10

Interface tailoring for CMOS, cryogenic electronics, and be..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),

Wan, H. W. ; Cheng, Y. T. ; Young, L. B.... - p. 1-2 , 2023

Link: https://doi.org/10.1109/..

11

Intercalated Graphene as Next Generation Back-end-of-Line C..:

, In: 2023 International Electron Devices Meeting (IEDM),

Li, S. W. ; Chan, Y. C. ; Hsu, C. H.... - p. i-iv , 2023

Link: https://doi.org/10.1109/..

12

Implementation of an AI-based competitive cheerleading coac..:

, In: IET International Conference on Engineering Technologies and Applications (ICETA 2023),

Yang, C.-H. ; Tu, J.-Y. ; Wu, D.-S.... - p. None , 2023

Link: https://doi.org/10.1049/..

13

Engineering defects in pristine amorphous chalcogenides for..:

, In: 2022 International Electron Devices Meeting (IEDM),

Ambrosi, E. ; Wu, C. H. ; Lee, H. Y.... - p. 18.7.1-18.7.4 , 2022

Link: https://doi.org/10.1109/..

14

Device Study on OTS-PCM for Persistent Memory Application :..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Chien, W. C. ; Gignac, L. M. ; Chou, Y. C.... - p. 327-329 , 2022

Link: https://doi.org/10.1109/..

15

High speed (1ns) and low voltage (1.5V) demonstration of 8K..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Song, M. Y. ; Lee, C. M. ; Yang, S. Y.... - p. 377-378 , 2022

Link: https://doi.org/10.1109/..