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Hsu, Hao Chiang
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1

Characteristics of Power Module with New Advanced Substrate:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Hao Chiang ; Cheng, Lu-Ken ; Chi, Wei-Hao. - p. 243-246 , 2020
Link: https://doi.org/10.1109/..
 
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2

Epoxy Resin Encapsulated IGBT Module Characteristics and Re..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Yu-Ju ; Chen, Hao-Chih ; Chi, Wei-Hao... - p. 120-123 , 2019
Link: https://doi.org/10.1109/..
 
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3

Activity Organization Queries for Location-Aware Heterogene..:

, In: Database Systems for Advanced Applications. DASFAA 2021 International Workshops; Lecture Notes in Computer Science,
Kankeu Fotsing, C. P. ; Teng, Ya-Wen ; Chiang, Sheng-Hao.. - p. 283-304 , 2021
Link: https://doi.org/10.1007/..
 
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4

Critical Process Features Enabling Aggressive Contacted Gat..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chang, Chih-Hao ; Chang, V.S. ; Pan, K.H.... - p. 27.1.1-27.1.4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Taylor Polynomial Enhancer using Genetic Programming for Sy..:

, In: Proceedings of the Companion Conference on Genetic and Evolutionary Computation,
Chang, Chi-Hsien ; Chiang, Tu-Chin ; Hsu, Tzu-Hao... - p. 543-546 , 2023
Link: https://dl.acm.org/doi/1..
 
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6

Interpreting Latent Representation in Neural Radiance Field..:

, In: 2023 IEEE International Conference on Image Processing (ICIP),
Huang, Yu-Shan ; Huang, Sheng-Yu ; Hsu, Hao-Yu. - p. 470-474 , 2023
Link: https://doi.org/10.1109/..
 
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7

High-Endurance MoS2 FeFET with Operating Voltage Fess Than ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Lee, Tsung-En ; Chiang, Hung-Li ; Chang, Chih-Yu... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Malignant Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Hu, Ming-Luen ; Chiu, Yi-Chun ; Tai, Wei-Chen... - p. 19-45 , 2023
Link: https://doi.org/10.1007/..
 
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9

Intelligent Recognition of Immune Cells: Analysis and Resea..:

, In: 2023 IEEE International Conference on e-Business Engineering (ICEBE),
Li, Chih-En ; Liu, Wei-Lun ; Lai, Kun-Yi... - p. 253-256 , 2023
Link: https://doi.org/10.1109/..
 
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10

NeurMiPs: Neural Mixture of Planar Experts for View Synthes..:

, In: 2022 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Lin, Zhi-Hao ; Ma, Wei-Chiu ; Hsu, Hao-Yu.. - p. 15681-15691 , 2022
Link: https://doi.org/10.1109/..
 
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11

VLSI Implementation of RISC MCU with In-Circuit Debugger:

, In: 2022 IEEE 5th International Conference on Knowledge Innovation and Invention (ICKII ),
Yen, Mao-Hsu ; Tsou, Cheng-Hao ; Lin, Ssu-Chi... - p. 63-68 , 2022
Link: https://doi.org/10.1109/..
 
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12

Self-Supervised Deep Learning for Fisheye Image Rectificati..:

, In: ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Chao, Chun-Hao ; Hsu, Pin-Lun ; Lee, Hung-Yi. - p. 2248-2252 , 2020
Link: https://doi.org/10.1109/..
 
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13

A mixed-reality showcase for multiple users from unconstrai..:

, In: SIGGRAPH Asia 2013 Emerging Technologies,
Hsu, Che-Hao ; Chiang, Chun-Chiao ; Hua, Kai-Lung. - p. 1-2 , 2013
Link: https://dl.acm.org/doi/1..
 
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14

Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge Fin..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chung, Hao-Tung ; Shih, Bo-Jheng ; Yang, Chih-Chao... - p. 34.5.1-34.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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15

15.5 A 28nm 64Kb 6T SRAM Computing-in-Memory Macro with 8b ..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Si, Xin ; Tu, Yung-Ning ; Huang, Wei-Hsing... - p. 246-248 , 2020
Link: https://doi.org/10.1109/..
 
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