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Hsu, Hung-Kai
571  Ergebnisse:
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1

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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2

Progressive Domain Adaptation for Object Detection:

, In: 2020 IEEE Winter Conference on Applications of Computer Vision (WACV),
Hsu, Han-Kai ; Yao, Chun-Han ; Tsai, Yi-Hsuan... - p. 738-746 , 2020
Link: https://doi.org/10.1109/..
 
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3

Evaluation of a Disaggregated Rack System:

, In: Proceedings of the 10th ACM SIGOPS Asia-Pacific Workshop on Systems,
Chiueh, Tzi-cker ; Hsu, Peng-Kai ; Lee, Chao-Tang... - p. 107-113 , 2019
Link: https://dl.acm.org/doi/1..
 
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4

Design and manufacturing process co-optimization in nano-te..:

, In: Proceedings of the 2014 IEEE/ACM International Conference on Computer-Aided Design,
Hsu, Meng-Kai ; Katta, Nitesh ; Lin, Homer Yen-Hung... - p. 574-581 , 2014
Link: https://dl.acm.org/doi/1..
 
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5

Integrating Physical Wheelchairs and Virtual Basketball for..:

, In: 2024 IEEE International Conference on Artificial Intelligence and eXtended and Virtual Reality (AIxVR),
Hsu, Yu-Hung ; Fang, Iuan-Kai ; Wang, Chun.. - p. 80-84 , 2024
Link: https://doi.org/10.1109/..
 
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6

A Thru-Reflect-Series-Resistance (TRS) Calibration for Cryo..:

, In: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023,
Chen, Yi-Ting ; Huang, Ian ; Lin, Min-Jui... - p. 1203-1206 , 2023
Link: https://doi.org/10.1109/..
 
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7

Develop an Intelligent Robotic Arm Grasp and Control System..:

, In: 2022 IEEE 4th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Hu, Nian-Ze ; Lin, Qi-Ren ; Wu, Ruo-Wei... - p. 582-584 , 2022
Link: https://doi.org/10.1109/..
 
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8

Keyword-Driven Depressive Tendency Model for Social Media P..:

, In: Business Information Systems; Lecture Notes in Business Information Processing,
Hu, Hsiao-Wei ; Hsu, Kai-Shyang ; Lee, Connie... - p. 14-22 , 2019
Link: https://doi.org/10.1007/..
 
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9

Full-duplex delay-and-forward relaying:

, In: Proceedings of the 17th ACM International Symposium on Mobile Ad Hoc Networking and Computing,
Hsu, Kai-Cheng ; Lin, Kate Ching-Ju ; Wei, Hung-Yu - p. 221-230 , 2016
Link: https://dl.acm.org/doi/1..
 
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10

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024
Link: https://doi.org/10.1109/..
 
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11

34.4 A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-D..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Fujiwara, Hidehiro ; Mori, Haruki ; Zhao, Wei-Chang... - p. 572-574 , 2024
Link: https://doi.org/10.1109/..
 
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12

In-Depth Mining Spatial Pattern Of Invasive Alien Species B..:

, In: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium,
Hung, Hao-Yuan ; Hsu, Chin-Rou ; Shao, Bao-Hua.. - p. 6208-6211 , 2023
Link: https://doi.org/10.1109/..
 
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13

A Wi-Fi Tri-band switchable Transceiver with 57.9fs-RMS-jit..:

, In: 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Chen, Tsung-Ming ; Liu, Ming-Chung ; Wu, Pi-An... - p. 181-184 , 2023
Link: https://doi.org/10.1109/..
 
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14

First BEOL-compatible, 10 ns-fast, and Durable 55 nm Top-pS..:

, In: 2023 International Electron Devices Meeting (IEDM),
Li, Kai-Shin ; Shieh, Jia-Min ; Chen, Yi-Ju... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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15

Ensemble Knowledge Distillation of Self-Supervised Speech M..:

, In: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Huang, Kuan -Po ; Feng, Tzu-Hsun ; Fu, Yu-Kuan... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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