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Hsu, Meng-Kai
289  Ergebnisse:
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1

Design and manufacturing process co-optimization in nano-te..:

, In: Proceedings of the 2014 IEEE/ACM International Conference on Computer-Aided Design,
Hsu, Meng-Kai ; Katta, Nitesh ; Lin, Homer Yen-Hung... - p. 574-581 , 2014
Link: https://dl.acm.org/doi/1..
 
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2

Routability-driven placement for hierarchical mixed-size ci..:

, In: Proceedings of the 50th Annual Design Automation Conference,
Hsu, Meng-Kai ; Chen, Yi-Fang ; Huang, Chau-Chin.. - p. 1-6 , 2013
Link: https://dl.acm.org/doi/1..
 
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3

Structure-aware placement for datapath-intensive circuit de..:

, In: Proceedings of the 49th Annual Design Automation Conference,
Chou, Sheng ; Hsu, Meng-Kai ; Chang, Yao-Wen - p. 762-767 , 2012
Link: https://dl.acm.org/doi/1..
 
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4

Routability-driven analytical placement for mixed-size circ..:

, In: Proceedings of the International Conference on Computer-Aided Design,
Hsu, Meng-Kai ; Chou, Sheng ; Lin, Tzu-Hen. - p. 80-84 , 2011
Link: https://dl.acm.org/doi/1..
 
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5

TSV-aware analytical placement for 3D IC designs:

, In: Proceedings of the 48th Design Automation Conference,
Hsu, Meng-Kai ; Chang, Yao-Wen ; Balabanov, Valeriy - p. 664-669 , 2011
Link: https://dl.acm.org/doi/1..
 
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6

Unified analytical global placement for large-scale mixed-s..:

, In: Proceedings of the International Conference on Computer-Aided Design,
Hsu, Meng-Kai ; Chang, Yao-Wen - p. 657-662 , 2010
Link: https://dl.acm.org/doi/1..
 
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7

Spare-cell-aware multilevel analytical placement:

, In: Proceedings of the 46th Annual Design Automation Conference,
Jiang, Zhe-Wei ; Hsu, Meng-Kai ; Chang, Yao-Wen. - p. 430-435 , 2009
Link: https://dl.acm.org/doi/1..
 
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8

Assessment of Impact on Navigation Safety in the Taiwan Str..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Tu, Meng-Ru ; Chen, Shih-Tzung ; Hsu, Huang-Kai. - p. 243-248 , 2023
Link: https://doi.org/10.1109/..
 
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9

Efficient multi-layer obstacle-avoiding rectilinear Steiner..:

, In: Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design,
Lin, Chung-Wei ; Huang, Shih-Lun ; Hsu, Kai-Chi.. - p. 380-385 , 2007
Link: https://dl.acm.org/doi/1..
 
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10

Electronic Packaging Interfacial Strength Measurement and D..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Shih, Meng-Kai ; Liu, Yu-Hao ; Lin, Guan-Sian.. - p. 269-270 , 2023
Link: https://doi.org/10.23919..
 
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11

First Demonstration of GAA Monolayer-MoS2 Nanosheet nFET wi..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chung, Yun-Yan ; Chou, Bo-Jhih ; Hsu, Chen-Feng... - p. 34.5.1-34.5.4 , 2022
Link: https://doi.org/10.1109/..
 
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12

15.5 A 28nm 64Kb 6T SRAM Computing-in-Memory Macro with 8b ..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Si, Xin ; Tu, Yung-Ning ; Huang, Wei-Hsing... - p. 246-248 , 2020
Link: https://doi.org/10.1109/..
 
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13

15.4 A 22nm 2Mb ReRAM Compute-in-Memory Macro with 121-28TO..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Xue, Cheng-Xin ; Huang, Tsung-Yuan ; Liu, Je-Syu... - p. 244-246 , 2020
Link: https://doi.org/10.1109/..
 
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14

5.9 A 0.8V Multimode Vision Sensor for Motion and Saliency ..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Hsu, Tzu-Hsiang ; Chen, Yen-Kai ; Wu, Jun-Shen... - p. 110-112 , 2020
Link: https://doi.org/10.1109/..
 
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15

A 0.5V Real-Time Computational CMOS Image Sensor with Progr..:

, In: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC),
Hsu, Tzu-Hsiang ; Chen, Yen-Kai ; Wen, Tai-Hsing... - p. 33-34 , 2019
Link: https://doi.org/10.1109/..
 
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