Hu, Kuang-Chun
143  Ergebnisse:
Personensuche X
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1

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
 
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2

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
 
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3

A Delay-Aware Implementation Scheme for Cost-Effective Impl..:

, In: 2019 IEEE International Test Conference in Asia (ITC-Asia),
 
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4

Practical Teaching Reform of Programming Courses Based on O..:

, In: Communications in Computer and Information Science; Computer Science and Education. Teaching and Curriculum,
Yuan, Guowu ; Yue, Kun ; Hu, Kuang - p. 316-326 , 2024
 
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5

Convolutional Neural Network Based Detection of Seasonal Fe..:

, In: 2022 IEEE 11th Global Conference on Consumer Electronics (GCCE),
Hu, Kuang ; Yue, Kun - p. 255-256 , 2022
 
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6

Representation-Based Completion of Knowledge Graph with Ope..:

, In: 2020 5th International Conference on Computer and Communication Systems (ICCCS),
Yue, Kun ; Wang, Jiahui ; Li, Xinbai. - p. 1-8 , 2020
 
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7

Amplification Gain of Nano-node Channel-width nMOSFETs with..:

, In: 2023 IEEE 3rd International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Lin, Yu-Chun ; Chao, Shou-Yen ; Chou, Ping-Chen... - p. 64-67 , 2023
 
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8

Microgrid Using Intelligent Controlled DSTATCOM for Power Q..:

, In: 2023 Sixth International Symposium on Computer, Consumer and Control (IS3C),
 
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9

Age of Information for Power-Saving Devices with DRX Mechan..:

, In: ICC 2023 - IEEE International Conference on Communications,
Lin, Hung-Chun ; Lin, Kuang-Hsun ; Wei, Hung-Yu - p. 3234-3239 , 2023
 
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10

A Flexible Cluster Tool Simulation Framework with Wafer Bat..:

, In: 2023 24th International Symposium on Quality Electronic Design (ISQED),
 
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11

In-Memory Approximate Computing Architecture Based on 3D-NA..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Tseng, Po-Hao ; Lin, Yu-Hsuan ; Lee, Feng-Ming... - p. 270-271 , 2022
 
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12

Thermal Design of SiC Power Module for EV/HEV Applications:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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13

To Improve The Efficiency of Electrostatic Discharge Protec..:

, In: 2022 8th International Conference on Applied System Innovation (ICASI),
Hsieh, Ming-Hong ; Hsieh, Chun-Chien ; Wu, Jia-Wun.. - p. 130-133 , 2022
 
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14

Efficient Unmanned Aerial Vehicles Assisted D2D Communicati..:

, In: Communications and Networking; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering,
 
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15

Cluster Tool Performance Analysis using Graph Database:

, In: 2021 IEEE 34th International System-on-Chip Conference (SOCC),
Huang, Shiuan-Hau ; Yen, Hsin-Ping ; Liu, Yan-Hsiu... - p. 230-235 , 2021
 
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