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Huang, Jhong-Yong
16  Ergebnisse:
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1

The development of the process for low-temperature surface ..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
Tsai, Pei-Chun ; Huang, Jhong-Ren ; Hong, Lu-Sheng - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Investigation of carrier lifetime behavior in the 4H-SiC ho..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
Chung, Shang-Lin ; Huang, Jhong-Ren ; Hong, Lu-Sheng - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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3

Very-large-scale Integration of a Dual-lead Electrocardiogr..:

, In: 2022 IEEE 4th Global Conference on Life Sciences and Technologies (LifeTech),
Chen, Yi-Fan ; Huang, Wei-Jhong ; Zeng, Yi-Wei... - p. 427-428 , 2022
Link: https://doi.org/10.1109/..
 
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4

LPSD: Low-Rank Plus Sparse Decomposition for Highly Compres..:

, In: Advances in Knowledge Discovery and Data Mining; Lecture Notes in Computer Science,
Huang, Kuei-Hsiang ; Sie, Cheng-Yu ; Lin, Jhong-En. - p. 353-364 , 2024
Link: https://doi.org/10.1007/..
 
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5

A Trustworthy Food Resume Traceability System Based on Bloc..:

, In: 2021 International Conference on Information Networking (ICOIN),
Lee, Meng-Ju ; Luo, Jhong-Ting ; Shao, Jia-Jung. - p. 546-552 , 2021
Link: https://doi.org/10.1109/..
 
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6

Agriculture Blockchain Service Platform for Farm-to-Fork Tr..:

, In: 2020 International Conference on Information Networking (ICOIN),
Chun-Ting, Pan ; Meng-Ju, Lee ; Nen-Fu, Huang.. - p. 158-163 , 2020
Link: https://doi.org/10.1109/..
 
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7

Exploring Traffic Features on Google Street View Images:

, In: Proceedings of the 2017 International Conference on Wireless Communications, Networking and Applications,
Tsai, Victor J. D. ; Chen, Jyun-Han ; Tsai, Pei-Shan.. - p. 230-234 , 2017
Link: https://dl.acm.org/doi/1..
 
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8

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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9

An Automated Biometric Identification System Using CNN-Base..:

, In: 2020 International Conference on Advanced Robotics and Intelligent Systems (ARIS),
Jhong, Sin-Ye ; Tseng, Po-Yen ; Siriphockpirom, Natnuntnita... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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10

Deep Learning Hardware/Software Co-Design for Heart Sound C..:

, In: 2020 International SoC Design Conference (ISOCC),
Jhong, Wun-Siou ; Chu, Shao-I ; Huang, Yu-Jung... - p. 27-28 , 2020
Link: https://doi.org/10.1109/..
 
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11

High-Precision Permaent Magent Motor Design for Satellite A..:

, In: IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society,
Chou, Po-Huan ; Yang, Shih-Chin ; Jhong, Ciao-Jhen.. - p. 802-805 , 2019
Link: https://doi.org/10.1109/..
 
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12

Ultra High Density Package Design and Electrical Analysis i..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hsieh, Tsun-Lung ; Kuo, Hung-Chun ; Jhong, Ming-Fong.. - p. 457-460 , 2019
Link: https://doi.org/10.1109/..
 
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13

The Comparison of Package Design and Electrical Analysis in..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Hsieh, Tsun-Lung ; Chou, Yuan-Hsi ; Pan, Po-Chih... - p. 1855-1860 , 2017
Link: https://doi.org/10.1109/..
 
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14

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
Link: https://doi.org/10.23919..
 
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15

Electrical Performance Analysis for Bridge Die Package Solu..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pan, Po Chih ; Chu, Fu Cheng ; Kuo, Hung Chun... - p. 113-114 , 2022
Link: https://doi.org/10.23919..
 
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