Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Huang, Tzu-Hsuan
349  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
?
1

A Binary BP Decoding Using Posterior Adjustment for Quantum..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Huang, Tzu-Hsuan ; Ueng, Yeong-Luh - p. 9001-9005 , 2024
Link: https://doi.org/10.1109/..
 
?
2

An Investigation of Cu/Ni/Ga Interfacial Reaction with Diff..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Tzu-hsuan ; Huang, Jian-wei ; Lin, Zhih-feng. - p. 135-136 , 2024
Link: https://doi.org/10.23919..
 
?
3

High thermal stability Cu-to-Cu joints fabricated by using ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Huang, Tzu-Hsuan ; Liu, Yu-Chen ; Cheng, Cheng-En... - p. 127-128 , 2022
Link: https://doi.org/10.23919..
 
?
4

The Risk Classification of Ergonomic Musculoskeletal Disord..:

, In: 2020 International Conference on Pervasive Artificial Intelligence (ICPAI),
Chan, Yu-Wei ; Huang, Tzu-Hsuan ; Tsan, Yu-Tse... - p. 268-271 , 2020
Link: https://doi.org/10.1109/..
 
?
5

Segmentation of Vestibular Schwannoma from Multi-parametric..:

, In: Proceedings of the 2019 2nd International Conference on Digital Medicine and Image Processing,
Lee, Wei-Kai ; Wu, Chih-Chun ; Huang, Tzu Hsuan... - p. 8-11 , 2019
Link: https://dl.acm.org/doi/1..
 
?
6

A Dispersion-Engineered YX-LN/SIO2/Sapphire SH-SAW Resonato..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Hsu, Tzu-Hsuan ; Lee, Zhi-Qiang ; Tsai, Chia-Hsien... - p. 27-30 , 2024
Link: https://doi.org/10.1109/..
 
?
7

A Thin-Film Lithium Niobate on Insulator Multimode SH-SAW R..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lin, Cheng-Chien ; Hsu, Tzu-Hsuan ; Lee, Zhi-Qiang... - p. 40-43 , 2024
Link: https://doi.org/10.1109/..
 
?
8

Thin-Film Lithium Niobate on Insulator Surface Acoustic Wav..:

, In: 2024 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM),
Hsu, Tzu-Hsuan ; Campbell, Joshua ; Kramer, Jack... - p. 117-120 , 2024
Link: https://doi.org/10.1109/..
 
?
9

Weak Devices Matter: Model Heterogeneity in Resource-Constr..:

, In: ICC 2024 - IEEE International Conference on Communications,
Peng, Tzu-Hsuan ; Huang, Cheng-Wei ; Pang, Ai-Chun. - p. 3274-3279 , 2024
Link: https://doi.org/10.1109/..
 
?
10

L-Band LiNbO3/SiO2/Sapphire Longitudinal Leaky Saw (LLSAW) ..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lee, Zhi-Qiang ; Hsu, Tzu-Hsuan ; Tsai, Chia-Hsien... - p. 1095-1098 , 2024
Link: https://doi.org/10.1109/..
 
?
11

Optimization of CFET Standard Cell Using Double-Cell-Height..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Huang, Liang-Chi ; Lu, Ko-Cheng ; Kang, Wei-Cheng... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
?
12

Improved Fault Diagnosis Method for PLC-Based Manufacturing..:

, In: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Huang, Kuan-Chun ; Ku, Hung-Ching ; Chuang, Tzu-Hsuan. - p. 705-710 , 2024
Link: https://doi.org/10.1109/..
 
?
13

Sub-3 DB Insertion Loss Broadband Acoustic Delay Lines and ..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Yeh, Chun-Chen ; Tsai, Chia-Hsien ; Wu, Guan-Lin.. - p. 1194-1197 , 2023
Link: https://doi.org/10.1109/..
 
?
14

Suppression of Spurious Modes in Aluminum Nitride S1 Lamb W..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Tung, Shao-Siang ; Hsu, Tzu-Hsuan ; Ho, Yens... - p. 1198-1201 , 2023
Link: https://doi.org/10.1109/..
 
?
15

Low Propagation Loss Acoustic Delay Lines based on YX-LiNbO..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Tsai, Chia-Hsien ; Hsu, Tzu-Hsuan ; Lee, Zhi-Qiang... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
1-15