E-LIB Suche - Ergebnisse für: Hung, Benjamin Y

1

Vitamin D Among Children in Asia: "What children get at age..:

, In: Nutritional Influences on Bone Health,

Lam, Tsz Ping ; Yip, Benjamin Hon Kei ; Lee, Wayne Y. W.... - p. 25-33 , 2018

Link: https://doi.org/10.1007/..

2

Contributors:

, In: Handbook of Nutrition, Diet and the Eye,

Abbott-Johnson, Winsome ; Acar, Niyazi ; Agte, Vaishali... - p. xv-xviii , 2014

Link: https://doi.org/10.1016/..

3

List of Contributors:

, In: Hunter's Tropical Medicine and Emerging Infectious Disease,

Acuin, Jose M ; Adam, Rodney D ; Agbenyega, Tsiri... - p. xiv-xxiv , 2013

Link: https://doi.org/10.1016/..

4

Rice Ecosystem Services in South-East Asia: The LEGATO Proj..:

, In: Atlas of Ecosystem Services,

Settele, Josef ; Spangenberg, Joachim H. ; Heong, Kong Luen... - p. 373-382 , 2019

Link: https://doi.org/10.1007/..

5

Contributors:

, In: The Electrical Engineering Handbook,

Ansari, Rashid ; Bashir, Faisal ; Bayoumi, Magdy... - p. ix-xiv , 2005

Link: https://doi.org/10.1016/..

6

Contributor contact details:

, In: Biomaterials and Tissue Engineering in Urology,

Denstedt, John ; Atala, Anthony ; Cadieux, P.... - p. xv-xxi , 2009

Link: https://doi.org/10.1016/..

7

Non-destructive evaluation (NDE) of composites: digital she..:

, In: Non-Destructive Evaluation (NDE) of Polymer Matrix Composites,

Hung, Y.Y. ; Yang, L.X. ; Huang, Y.H. - p. 84-115 , 2013

Link: https://doi.org/10.1533/..

8

Contributor contact details:

, In: Non-Destructive Evaluation (NDE) of Polymer Matrix Composites,

Karbhari, Vistasp M. ; Huang, Jerry Q. ; Heuer, Henning... - p. xv-xx , 2013

Link: https://doi.org/10.1016/..

9

Spatial light modulator (SLM) steering enabled NOMA in mult..:

, In: 49th European Conference on Optical Communications (ECOC 2023),

Wei, T. -C. ; Jian, Y. -H. ; Hung, T. -Y.... - p. None , 2023

Link: https://doi.org/10.1049/..

10

Complementary Field-Effect Transistor (CFET) Demonstration ..:

, In: 2023 International Electron Devices Meeting (IEDM),

Liao, S. ; Yang, L. ; Chiu, T.K.... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

11

Enhanced Reactivity of Electroless Cu Interconnection by Su..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Lin, Y. C. ; Shen, C. H. ; Hung, C. Y.... - p. 147-148 , 2023

Link: https://doi.org/10.23919..

12

Nelder-Mead Tuned PID Control for a Futuristic Geared-Turbo..:

, In: 2023 23rd International Conference on Control, Automation and Systems (ICCAS),

Lamas, Rodrigo M. L. S ; Hung, John Y. - p. 821-826 , 2023

Link: https://doi.org/10.23919..

13

Fan-out Wafer-level Packaging Process Integration for Artif..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Ouyang, T. Y. ; Xiovo, O. Y. ; Cheng, R. S.... - p. 290-293 , 2023

Link: https://doi.org/10.1109/..

14

Pre-fabricated High-density TSV Interposer for Programmable..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Ouyang, T. Y. ; Hung, Y. T. ; Lee, O. H.... - p. 1-4 , 2022

Link: https://doi.org/10.1109/..

15

Environmental Complexity Measurement Using Shannon Entropy:

, In: 2020 SoutheastCon,

Xia, Xue ; Roppel, Thaddeus ; Hung, John Y.... - p. 1-6 , 2020

Link: https://doi.org/10.1109/..