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2007 International Conference on Electronic Materials and Packaging ,
1
Board level reliability assessments of package on package:
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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
3
PSP Model-Based Emulation Method for Geometry-Dependent Cry..:
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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
4
Compact Characteristic Modeling of Cryo-CMOS Transistors Ba..:
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2023 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
5
A 1.08ms Ultrafast Scanning Capacitive Touch-Screen Sensor ..:
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2023 20th International SoC Design Conference (ISOCC) ,
6
A 0.4-VIN, External-Capacitor-Free, Adaptive-Biased LDO wit..:
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2022 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
7
A 0.0043-mm2 Capacitorless External-Clock-Free Fully-Synthe..:
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The Handbook of Historical Economics ,
10
How institutions and cultures change: an evolutionary persp..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
11
25.2 A 480mA Output-Capacitor-Free Synthesizable Digital LD..:
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ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference (ESSCIRC) ,
12
An Always-On 0.53-to-13.4 mW Power-Scalable Touchscreen Con..:
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2006 37th IEEE Power Electronics Specialists Conference ,
13
High-precision and decomposition control of several permane..:
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2006 37th IEEE Power Electronics Specialists Conference ,
14
A method for rotor vibration monitoring of induction motor ..:
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2006 37th IEEE Power Electronics Specialists Conference ,
15