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2007 International Conference on Electronic Materials and Packaging ,
1
Board level reliability assessments of package on package:
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2017 IEEE International Electron Devices Meeting (IEDM) ,
2
Breakthrough of selector technology for cross-point 25-nm R..:
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2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
3
Highly manufacturable Self-Aigned Direct Backside Contact (..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
4
13.6 A 16Gb 37Gb/s GDDR7 DRAM with PAM3-Optimized TRX Equal..:
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Proceedings of the 8th International Conference on Ubiquitous Information Management and Communication ,
6
Computing paper similarity based on latent dirichlet alloca..:
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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
7
PSP Model-Based Emulation Method for Geometry-Dependent Cry..:
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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
8
Compact Characteristic Modeling of Cryo-CMOS Transistors Ba..:
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2023 20th International SoC Design Conference (ISOCC) ,
9
A 0.4-VIN, External-Capacitor-Free, Adaptive-Biased LDO wit..:
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2023 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
10
A 1.08ms Ultrafast Scanning Capacitive Touch-Screen Sensor ..:
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2022 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
11
A 0.0043-mm2 Capacitorless External-Clock-Free Fully-Synthe..:
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The Handbook of Historical Economics ,
13
How institutions and cultures change: an evolutionary persp..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
15