Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Jalar, Azman
12  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
?
1

Thermal Management on the Solder Joints of Adjacent Ball Gr..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Ismail, Adlil Aizat ; Abu Bakar, Maria ; Ehsan, Abang Annuar... - p. 103-113 , 2023
Link: https://doi.org/10.1007/..
 
?
2

Effect of Thermomechanical Treatment on Microstructural and..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Mohd Yusoff, Fateh Amera ; Abu Bakar, Maria ; Jalar, Azman - p. 133-144 , 2023
Link: https://doi.org/10.1007/..
 
?
3

Study on Forming and Properties of Heat Resistant Low Expan..:

, In: 2023 International Conference on Mechatronics, IoT and Industrial Informatics (ICMIII),
Li, Zhiyong ; Jalar, Azman - p. 292-296 , 2023
Link: https://doi.org/10.1109/..
 
?
4

Effect of Ultrasonic Process Parameter on Resistance and Pl..:

, In: TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON),
Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli ; Jalar, Azman... - p. 1288-1292 , 2023
Link: https://doi.org/10.1109/..
 
?
5

Measurement of Aluminium Remnant Thickness on Copper Wire B..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Supramaniam, Saraswathy ; Periasamy, Subashini ; Nurhisham, Muhammad.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
?
6

Voltage Bias Enhancement for Leakage Test on Discrete Produ..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Nizam Bin Nik Zainuddin, Nik Ahmad ; Binti Mohamad Yasin, Nur Yashidar ; Binti Ardnan, Nur Syazreen... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
?
7

Effects of Underfill Materials on Behavior of Intermetallic..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Ismail, Adlil Aizat ; Bakar, Maria Abu ; Ehsan, Abang Annuar... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
?
8

Intermetallic Compound Thickness of Ball Grid Array Solder ..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Ismail, Adlil Aizat ; Bakar, Maria Abu ; Ehsan, Abang Annuar... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
?
9

Effect of Moisture Content on Crack Formation During Reflow..:

, In: Advances in Robotics, Automation and Data Analytics; Advances in Intelligent Systems and Computing,
Zain, Syed Mohamad Mardzukey Syed Mohamed ; Ani, Fakhrozi Che ; Ramli, Mohamad Riduwan.. - p. 309-314 , 2021
Link: https://doi.org/10.1007/..
 
?
10

Effect of Potting Encapsulation on Crack Formation and Prop..:

, In: Advances in Robotics, Automation and Data Analytics; Advances in Intelligent Systems and Computing,
Jalar, Azman ; Zain, Syed Mohamad Mardzukey Syed Mohamed ; Ani, Fakhrozi Che.. - p. 351-357 , 2021
Link: https://doi.org/10.1007/..
 
?
11

Elucidation of Metal Etching Defects Through the Experiment..:

, In: 2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM),
Ahmad Taufiq, Nadia Nor ; Hamid, Khirullah bin Abdul ; Badarisman, Aiman Hakim... - p. 69-72 , 2021
Link: https://doi.org/10.1109/..
 
?
12

Contributors:

, In: Industrial Applications of Nanocellulose and Its Nanocomposites,
Abd-Rahim, Nur Farisha ; Asa'ari, Ainun Zuriyati Mohamed ; Aisyah, H.A.... - p. xiii-xx , 2022
Link: https://doi.org/10.1016/..
 
1-12