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2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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A Comprehensive Methodology for Optimizing Power Integrity ..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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High Bandwidth Low Power 2.5D Interconnect Modeling and Des..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Signal, Power and Thermal Co-optimization Methodology for F..:
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2024 IEEE Custom Integrated Circuits Conference (CICC) ,
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Design of 224Gb/s DSP-Based Transceiver in CMOS Technology:..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
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On-silicon Capacitor Sharing Technique Based on Package Pow..:
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2022 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) ,
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Package Optimization Methodologies to Meet PI Challenges in..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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High-Density 56Gbps PAM4 Package Design Enablement with Cos..:
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Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems ,
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Designing Ambient Narrative-Based Interfaces to Reflect and..:
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SIGGRAPH ASIA 2016 Virtual Reality meets Physical Reality: Modelling and Simulating Virtual Humans and Environments ,
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A virtual reality platform for dynamic human-scene interact..:
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Advanced Bioimaging Technologies in Assessment of the Quality of Bone and Scaffold Materials ,
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