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Kao, C.
139  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

HAZ-free Direct Laser Machining on Silicone-Based Flexible ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, M. H. ; Cheng, C. I ; Lin, Y. C.. - p. 25-26 , 2024
Link: https://doi.org/10.23919..
 
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2

Applying Random Forest Algorithm to Predicting the Stock Pr..:

, In: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),
Kao, C. C. ; ChiangLin, C.Y ; Yang, K. C. - p. 0098-0102 , 2023
Link: https://doi.org/10.1109/..
 
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3

Enhanced Cu-to-Cu Bonding by Using Sn Passivation Layer:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Kung, P. Y. ; Huang, W. L. ; Kao, C. L... - p. 29-30 , 2023
Link: https://doi.org/10.23919..
 
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4

Enhanced Reactivity of Electroless Cu Interconnection by Su..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Y. C. ; Shen, C. H. ; Hung, C. Y.... - p. 147-148 , 2023
Link: https://doi.org/10.23919..
 
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5

Applying Three Deep Learning Techniques to Predicting Stock..:

, In: 2022 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),
Kao, C.C. ; ChiangLin, C.Y. ; Yang, K. C. - p. 132-136 , 2022
Link: https://doi.org/10.1109/..
 
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6

Development of Cu-Cu Side-by-Side Interconnection Using Con..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chen, Y. A. ; Shih, P. S. ; Chang, F. L.... - p. 956-961 , 2022
Link: https://doi.org/10.1109/..
 
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7

An IDDQ-based source driver IC design-for-test technique:

, In: Proceedings of the International Conference on Computer-Aided Design,
Lin, S.-S. ; Kao, C.-L. ; Huang, J.-L... - p. 393-398 , 2013
Link: https://dl.acm.org/doi/1..
 
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8

Basics of Imaging Theory and Statistics:

, In: Emission Tomography,
KAO, C ; LARIVIERE, P ; PAN, X - p. 103-126 , 2004
Link: https://doi.org/10.1016/..
 
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9

Determination of Interlayer Domain Correlations in Magnetic..:

, In: 7th Joint MMM-Intermag Conference. Abstracts (Cat. No.98CH36275),
Idzerda, Y.U. ; Freeland, J.W. ; Chakarian, V.. - p. 364 , 1998
Link: https://doi.org/10.1109/..
 
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10

Exploring Magnetic Roughness in Cofe Thin Films:

, In: 7th Joint MMM-Intermag Conference. Abstracts (Cat. No.98CH36275),
Freeland, J.W. ; Chakarian, V. ; Bussmann, K.... - p. 27 , 1998
Link: https://doi.org/10.1109/..
 
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11

Hard X-Ray Reflectivity on Thin Co Films:

, In: 7th Joint MMM-Intermag Conference. Abstracts (Cat. No.98CH36275),
Lott, D. ; Kao, C.C. ; Hastings, J.B.. - p. 28 , 1998
Link: https://doi.org/10.1109/..
 
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12

Directly Identifying the Order of Layer Switching in Magnet..:

, In: 7th Joint MMM-Intermag Conference. Abstracts (Cat. No.98CH36275),
Chakarian, V. ; Freeland, J.W. ; Idzerda, Y.U.... - p. 363 , 1998
Link: https://doi.org/10.1109/..
 
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13

Contributors:

, In: Quantification of Brain Function Using PET,
Adam, M. ; Alpert, Nathaniel M. ; Anderson, J.R.... - p. xvii-xxvi , 1996
Link: https://doi.org/10.1016/..
 
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14

Computer expansion of Boolean expressions:

, In: Proceedings of the 8th Design Automation Workshop,
Chuang, Y. H. ; Kao, C. C. - p. 378-383 , 1971
Link: https://dl.acm.org/doi/1..
 
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15

Large-Scale Cu Interconnection of Organic Substrate Materia..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, M. L. ; Shih, P. S. ; Huang, J. H.... - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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