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X
Kao, Joseph P.Y.
42  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Contributors:

, In: Perioperative Medicine,
Agopian, Vatche G. ; Al-Bizri, Ehab ; Andrew, Benjamin Y.... - p. vi-xii , 2022
Link: https://doi.org/10.1016/..
 
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2

List of contributors:

, In: Manual of Chronic Total Occlusion Percutaneous Coronary Interventions,
Abi Rafeh, Nidal ; Agostoni, Pierfrancesco ; Akyuz, Sukru... - p. xxi-xxx , 2023
Link: https://doi.org/10.1016/..
 
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3

List of Contributors:

, In: Neuropathology of Drug Addictions and Substance Misuse,
Abadie-Guedes, Ricardo ; Abi-Dargham, Anissa ; Abulseoud, Osama A.... - p. xxvii-xxxv , 2016
Link: https://doi.org/10.1016/..
 
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4

Contributors:

, In: Handbook of Biologically Active Peptides,
Adams, Michael E. ; Ait-Ali, Djida ; Allen, Stephanie D.... - p. xix-xxxviii , 2006
Link: https://doi.org/10.1016/..
 
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5

Design and development of a customizable and instructional ..:

, In: IET International Conference on Engineering Technologies and Applications (ICETA 2023),
Huang, H. -L. ; Hsueh, Y. -H. ; Lin, F. -R.... - p. None , 2023
Link: https://doi.org/10.1049/..
 
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6

Kinetics of solidification of cross-linked polyethylene:

, In: Conference on Electrical Insulation & Dielectric Phenomena - Annual Report 1982,
Kao, Y.-H. ; Tseng, H.-T. ; Phillips, P. J. - p. 281-286 , 1982
Link: https://doi.org/10.1109/..
 
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7

Fabrication and Characterization of Millimeter Wave 3D InFO..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Tsai, C. H. ; Wu, T. L. ; Liu, C. S.... - p. 25.3.1-25.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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8

Towards overcoming the transitive-closure bottleneck: effic..:

, In: Proceedings of the twenty-second annual ACM symposium on Theory of Computing,
Kao, M.-Y. ; Klein, P. N. - p. 181-192 , 1990
Link: https://dl.acm.org/doi/1..
 
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9

W-band InGaAs HEMT low noise amplifiers:

, In: IEEE International Digest on Microwave Symposium,
Duh, K.H.G. ; Chao, P.C. ; Ho, P.... - p. 595,596,597,598 , 1990
Link: https://doi.org/10.1109/..
 
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10

Investigation of Additional Elements in Sn-Bi Based Low-Tem..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chang, F. L. ; Chen, Y. C. ; Lin, Y. H.... - p. 203-204 , 2024
Link: https://doi.org/10.23919..
 
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11

Performing Machine Learning Based Outlier Detection for Aut..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Yang, Y.L. ; Tsao, P.C. ; Lin, C.W.... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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12

Reliability Prediction Platform of SiC Half Bridge Power Mo..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Syu, J. Y. ; Huang, Y. C. ; Liu, Y. C.... - p. 93-94 , 2023
Link: https://doi.org/10.23919..
 
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13

An Area and Energy Efficient All Resistive Neuromorphic-Com..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Wu, J. P. ; Lee, M. Y. ; Kao, T. C.... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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14

MOSFET Characterization with Reduced Supply Voltage at Low ..:

, In: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC),
Lin, W.-C. ; Huang, H.-P. ; Kao, K.-H.... - p. 9-12 , 2023
Link: https://doi.org/10.1109/..
 
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15

Enhanced Cu-to-Cu Bonding by Using Sn Passivation Layer:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Kung, P. Y. ; Huang, W. L. ; Kao, C. L... - p. 29-30 , 2023
Link: https://doi.org/10.23919..
 
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