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X
Kao, Kevin R.
94  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

List of contributors:

, In: Manual of Chronic Total Occlusion Percutaneous Coronary Interventions,
Abi Rafeh, Nidal ; Agostoni, Pierfrancesco ; Akyuz, Sukru... - p. xxi-xxx , 2023
Link: https://doi.org/10.1016/..
 
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2

List of Contributors:

, In: Molecular Beam Epitaxy,
Addou, Rafik ; Aho, Arto ; Andrews, Aaron M.... - p. xi-xiii , 2018
Link: https://doi.org/10.1016/..
 
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3

Investigation of Additional Elements in Sn-Bi Based Low-Tem..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chang, F. L. ; Chen, Y. C. ; Lin, Y. H.... - p. 203-204 , 2024
Link: https://doi.org/10.23919..
 
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4

A Thermodynamic Modeling Approach for the Design and Develo..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Y. C. ; Chang, F. L. ; Chuang, M. C... - p. 205-206 , 2024
Link: https://doi.org/10.23919..
 
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5

Large-Scale Cu Interconnection of Organic Substrate Materia..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, M. L. ; Shih, P. S. ; Huang, J. H.... - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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6

A novel and simple method of low temperature, low process t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Jeng-Hau ; Shih, Po-Shao ; Shen, Chang-Hsien... - p. 1660-1663 , 2023
Link: https://doi.org/10.1109/..
 
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7

Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Tatsumi, Hiroaki ; Kao, C.R. ; Nishikawa, Hiroshi - p. 149-150 , 2023
Link: https://doi.org/10.23919..
 
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8

Investigation of the Stability of CuIn2 in Cu-In Phase Diag..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chang, F. L. ; Lin, Y. H. ; Kao, C. R. - p. 205-206 , 2023
Link: https://doi.org/10.23919..
 
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9

Optical Measurements of the Skin Surface to Infer Bilateral..:

, In: 2023 IEEE World Haptics Conference (WHC),
Kao, Anika R. ; Landsman, Zack T. ; Gerling, Gregory J.. - p. 244-251 , 2023
Link: https://doi.org/10.1109/..
 
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10

Interfacial Reaction Between Silver and Solid Indium:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Fang, I. C. ; Chang, F. L. ; Chang, C. C.. - p. 207-208 , 2023
Link: https://doi.org/10.23919..
 
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11

Enhanced Cu-to-Cu Bonding by Using Sn Passivation Layer:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Kung, P. Y. ; Huang, W. L. ; Kao, C. L... - p. 29-30 , 2023
Link: https://doi.org/10.23919..
 
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12

Human-Delivered Brushstroke Characterization Using an Instr..:

, In: 2023 IEEE World Haptics Conference (WHC),
Landsman, Zack T. ; Kao, Anika R. ; Gerling, Gregory J. - p. 85-92 , 2023
Link: https://doi.org/10.1109/..
 
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13

Enhanced Reactivity of Electroless Cu Interconnection by Su..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Y. C. ; Shen, C. H. ; Hung, C. Y.... - p. 147-148 , 2023
Link: https://doi.org/10.23919..
 
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14

Key steps from laboratory towards mass production: Optimiza..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Grafner, S. J. ; Huang, J. H. ; Chen, Y. A.... - p. 539-547 , 2022
Link: https://doi.org/10.1109/..
 
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15

Terminal Reaction Behaviors in Micro Bumps: Comparison of T..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Kao, Chen-Wei ; Kung, Po-Yu ; Chang, Chih-Chia. - p. 45-46 , 2022
Link: https://doi.org/10.23919..
 
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