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Kim, Dae Ha
492  Ergebnisse:
Buchkapitel (Online) X
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1

Continuous Engagement Estimation based on Gaze Estimation a..:

, In: 2022 37th International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC),
Kim, Seong Ho ; Lee, Dong Jun ; Kim, Dae Ha. - p. 937-939 , 2022
Link: https://doi.org/10.1109/..
 
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2

Hidden Emotion Detection using Multi-modal Signals:

, In: Extended Abstracts of the 2021 CHI Conference on Human Factors in Computing Systems,
Song, Byung Cheol ; Kim, Dae Ha - p. 1-7 , 2021
Link: https://dl.acm.org/doi/1..
 
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3

Visual Scene-aware Hybrid Neural Network Architecture for V..:

, In: 2019 14th IEEE International Conference on Automatic Face & Gesture Recognition (FG 2019),
Lee, Min Kyu ; Yoon Choi, Dong ; Kim, Dae Ha. - p. 1-8 , 2019
Link: https://doi.org/10.1109/..
 
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4

Metric-Based Regularization and Temporal Ensemble for Multi..:

, In: 2019 IEEE/CVF International Conference on Computer Vision Workshop (ICCVW),
Song, Byung Cheol ; Kim, Dae Ha ; Lee, Seung hyun - p. 2903-2912 , 2019
Link: https://doi.org/10.1109/..
 
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5

Self-supervised Knowledge Distillation Using Singular Value..:

, In: Computer Vision – ECCV 2018; Lecture Notes in Computer Science,
Lee, Seung Hyun ; Kim, Dae Ha ; Song, Byung Cheol - p. 339-354 , 2018
Link: https://doi.org/10.1007/..
 
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6

Multi-modal emotion recognition using semi-supervised learn..:

, In: Proceedings of the 19th ACM International Conference on Multimodal Interaction,
Kim, Dae Ha ; Lee, Min Kyu ; Choi, Dong Yoon. - p. 529-535 , 2017
Link: https://dl.acm.org/doi/1..
 
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7

RPFNET: Complementary Feature Fusion for Hand Gesture Recog..:

, In: 2022 IEEE International Conference on Image Processing (ICIP),
Yeon Kim, Do ; Ha Kim, Dae ; Cheol Song, Byung - p. 986-990 , 2022
Link: https://doi.org/10.1109/..
 
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8

Lumbar Interbody Fusion Extension for Symptomatic Adjacent ..:

, In: Unilateral Biportal Endoscopic Spine Surgery,
Ha, Ji Soo ; Heo, Dong Hwa ; Sung, Kang Hyon.. - p. 167-176 , 2022
Link: https://doi.org/10.1007/..
 
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9

First-principles study of the conduction mechanism in tanta..:

, In: 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Lee, Juho ; Kim, Seunghyun ; Kim, Hyoseok... - p. 197-200 , 2023
Link: https://doi.org/10.23919..
 
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10

A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep C..:

, In: 2023 International Electron Devices Meeting (IEDM),
Lee, Gwi-Deok Ryan ; Kim, Dae-Hoon ; Kwon, Doowon... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

VOC Based Key Quality Indicators for High-Speed Internet Se..:

, In: 2008 The Third International Conference on Internet Monitoring and Protection,
Kim, Dae-Woo ; Lim, Hyun-Min ; Yoo, Jae-Hyoung. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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12

Vision-based Human-Robot Interaction Components for URC Int..:

, In: 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems,
Kwak, Keun-chang ; Kim, Do-hyung ; Song, Byoung-youl... - p. None , 2006
Link: https://doi.org/10.1109/..
 
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13

Effects of data bundling in non-strict data structures:

, In: Proceedings of the IFIP WG10.3 working conference on Parallel architectures and compilation techniques,
Rho, Eun Ha ; Han, Sang Yong ; Kim, Heung Hwan. - p. 140-148 , 1995
Link: https://dl.acm.org/doi/1..
 
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14

Gate-all-around Twin Silicon nanowire SONOS Memory:

, In: 2007 IEEE Symposium on VLSI Technology,
Suk, Sung Dae ; Yeo, Kyoung Hwan ; Cho, Keun Hwi... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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15

Synchronous Rectification for a Two-Transformer Active-Clam..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Kim, Seokwon ; Sung, Hanhim ; Lee, Dae-Woo... - p. 793-800 , 2024
Link: https://doi.org/10.1109/..
 
1-15