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Kim, Dae-Min
503  Ergebnisse:
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1

A Study of the Comparative Evaluation System of the Lower-L..:

, In: Communications in Computer and Information Science; HCI International 2023 – Late Breaking Posters,
Kong, Yong-Ku ; Park, Sang-Soo ; Shim, Jin-Woo... - p. 485-492 , 2023
Link: https://doi.org/10.1007/..
 
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2

A study on D2W Hybrid Cu bonding Technology for HBM Multi-d..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Hyeonmin ; Kim, Jihoon ; Kim, Min-Ki... - p. 76-80 , 2024
Link: https://doi.org/10.1109/..
 
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3

A W-Band Low-Noise Amplifier in 50-nm InP HEMT Technology:

, In: 2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS),
Mehraban, Haniye ; Park, Wan-Soo ; Jo, Hyeon-Bin... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

On the universality of drain-induced-barrier-lowering in fi..:

, In: 2022 International Electron Devices Meeting (IEDM),
Choi, Su-Min ; Jo, Hyeon-Bhin ; Yun, Do-Young... - p. 8.3.1-8.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Terahertz In0.8 Ga0.2 As quantum-well HEMTs toward 6G appli..:

, In: 2022 International Electron Devices Meeting (IEDM),
Park, Wan-Soo ; Jo, Hyeon-Bhin ; Kim, Hyo-Jin... - p. 11.4.1-11.4.4 , 2022
Link: https://doi.org/10.1109/..
 
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6

A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exp..:

, In: 2022 IEEE International Solid-State Circuits Conference (ISSCC),
Kim, Dae-Hyun ; Song, Byungkyu ; Ahn, Hyun-a... - p. 448-450 , 2022
Link: https://doi.org/10.1109/..
 
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7

Characterization of Die-to-Wafer Hybrid Bonding using Heter..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Min-Ki ; Park, Soojeoung ; Jang, Aeni... - p. 335-339 , 2022
Link: https://doi.org/10.1109/..
 
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8

$\text{In}_{x}\text{Ga}_{1-x}\text{As}$ quantum-well high-e..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Yun, Seung-Won ; Jo, Hyeon-Bhin ; Yoo, Ji-Hoon... - p. 11.3.1-11.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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9

A Study on the Mechanical Debonding Process through Static-..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lee, Hyeong-Gi ; Kim, Dae-Sung ; Cho, Jung-Hyun... - p. 303-308 , 2020
Link: https://doi.org/10.1109/..
 
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10

Power Integrity Performance Gain of a Novel Integrated Stac..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Song, Eunseok ; Oh, Dan Kyung Suk ; Cha, Seung-Yong... - p. 1358-1362 , 2020
Link: https://doi.org/10.1109/..
 
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11

Reconfigurable battery system with active balancing circuit:

, In: IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society,
Lee, Kyung-Min ; Kim, Dae-Hyun ; Shin, Jae-Hyuck... - p. 4583-4586 , 2019
Link: https://doi.org/10.1109/..
 
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12

Optimal Design of RFECT System for Inspection of 16-inch Fe..:

, In: Lecture Notes in Electrical Engineering; AETA 2017 - Recent Advances in Electrical Engineering and Related Sciences: Theory and Application,
Kim, Jong Min ; Kim, Dae-Kwang ; Cho, Sung-Ho... - p. 1057-1067 , 2017
Link: https://doi.org/10.1007/..
 
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13

Reducing overfitting of AdaBoost by clustering-based prunin..:

, In: Proceedings of the 7th International Conference on Ubiquitous Information Management and Communication,
Kim, Dae-Sun ; Baek, Yeul-Min ; Kim, Whoi-Yul - p. 1-3 , 2013
Link: https://dl.acm.org/doi/1..
 
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14

Contributors:

, In: The Human Nervous System,
Adamczyk, Christopher ; Adler, Avital ; Amaral, David G.... - p. ix-x , 2012
Link: https://doi.org/10.1016/..
 
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15

VOC Based Key Quality Indicators for High-Speed Internet Se..:

, In: 2008 The Third International Conference on Internet Monitoring and Protection,
Kim, Dae-Woo ; Lim, Hyun-Min ; Yoo, Jae-Hyoung. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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