Kim, Do-hun
425  Ergebnisse:
Personensuche X
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1

Thermal damage free materials processing by using ultrashor..:

, In: 2019 Conference on Lasers and Electro-Optics (CLEO),
 
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2

A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exp..:

, In: 2022 IEEE International Solid-State Circuits Conference (ISSCC),
Kim, Dae-Hyun ; Song, Byungkyu ; Ahn, Hyun-a... - p. 448-450 , 2022
 
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3

Room Temperature Control and Fire Alarm/Suppression IoT Ser..:

, In: 2017 International Conference on Platform Technology and Service (PlatCon),
 
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4

A Preemption Method for QoS Based on Time-Sensitive Network:

, In: 2023 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC),
 
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5

Performance Analysis of Frame Merging Methods on Time-Sensi..:

, In: 2023 IEEE International Conference on Consumer Electronics-Asia (ICCE-Asia),
 
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6

Analyzing the Impact of ECU Synchronization on the SOME/IP ..:

, In: 2023 IEEE International Conference on Consumer Electronics-Asia (ICCE-Asia),
 
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7

Land-Vehicle Navigation System for Autonomous Driving with ..:

, In: 2019 IEEE Vehicle Power and Propulsion Conference (VPPC),
Choi, Min Jun ; Kim, Yong Hun ; Kim, Eung Ju.. - p. 1-5 , 2019
 
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8

Advanced Color Filter Isolation Technology for Sub-Micron P..:

, In: 2022 International Electron Devices Meeting (IEDM),
Bak, Hojin ; Lee, Horyeong ; Kim, Won-Jin... - p. 37.6.1-37.6.4 , 2022
 
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9

Target Detection using U-Net for a DTV-based Passive Bistat..:

, In: 2022 International Conference on Artificial Intelligence in Information and Communication (ICAIIC),
Park, Ji-Hun ; Park, Do-Hyun ; Kim, Hyoung-Nam - p. 176-178 , 2022
 
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10

A Fast and Accurate Convolutional Neural Network for LPI Ra..:

, In: 2022 19th European Radar Conference (EuRAD),
 
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11

Design of high payload dual arm robot with modifiable forea..:

, In: 2017 14th International Conference on Ubiquitous Robots and Ambient Intelligence (URAI),
Kim, Hwi-Su ; Park, Chan-Hun ; Park, Dong-il... - p. 83-84 , 2017
 
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12

Robust video watermarking for MPEG compression and DA-AD co..:

, In: Proceedings of the 1st international workshop on Information hiding and its criteria for evaluation,
Hou, Jong-Uk ; Park, Jin-Seok ; Kim, Do-Guk.. - p. 2-8 , 2014
 
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13

13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Jung, Wontaeck ; Kim, Hyunggon ; Kim, Do-Bin... - p. 236-237 , 2024
 
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14

Hybrid 3D Package with RDL and Laminate Substrate for Ultra..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Kim, JaeYoon ; Kim, KyeRyung ; Lee, EunYoung... - p. 1-5 , 2020
 
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15

8.7 A 92.7% Peak Efficiency 12V-to-60V Input to 1.2V Output..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Choi, Hyeon-Ji ; Lee, Chan-Ho ; Jeon, Young-Jun... - p. 156-158 , 2024
 
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