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Kim, Joon-sik
413  Ergebnisse:
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1

Contributors:

, In: Smart Cities for Technological and Social Innovation,
Albornoz, Camila ; Barrett, Brendan F.D. ; Chen, Yiqun... - p. xiii-xiv , 2021
Link: https://doi.org/10.1016/..
 
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2

Understanding stakeholder perceptions in smart cities: Appl..:

, In: Smart Cities for Technological and Social Innovation,
Kim, Joon Sik ; Feng, Yanru - p. 115-135 , 2021
Link: https://doi.org/10.1016/..
 
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3

Rotation Key Reduction for Client-Server Systems of Deep Ne..:

, In: Advances in Cryptology – ASIACRYPT 2023; Lecture Notes in Computer Science,
Lee, Joon-Woo ; Lee, Eunsang ; Kim, Young-Sik. - p. 36-68 , 2023
Link: https://doi.org/10.1007/..
 
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4

High-Precision Bootstrapping for Approximate Homomorphic En..:

, In: Advances in Cryptology – EUROCRYPT 2022; Lecture Notes in Computer Science,
Lee, Yongwoo ; Lee, Joon-Woo ; Kim, Young-Sik... - p. 551-580 , 2022
Link: https://doi.org/10.1007/..
 
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5

High-Precision Bootstrapping of RNS-CKKS Homomorphic Encryp..:

, In: Lecture Notes in Computer Science; Advances in Cryptology – EUROCRYPT 2021,
Lee, Joon-Woo ; Lee, Eunsang ; Lee, Yongwoo.. - p. 618-647 , 2021
Link: https://doi.org/10.1007/..
 
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6

A Low Loss Die-Embedded Glass Substrate for 140 GHz InP Pow..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,
Jia, Xiaofan ; Li, Xingchen ; Kim, Joon Woo... - p. 402-405 , 2024
Link: https://doi.org/10.1109/..
 
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7

Die-Embedded Glass Interposer with Minimum Warpage for 5G/6..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Li, Xingchen ; Jia, Xiaofan ; Kim, Joon Woo... - p. 2247-2254 , 2023
Link: https://doi.org/10.1109/..
 
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8

Chip-embedded Glass Interposer for 5G Applications:

, In: 2023 IEEE Radio and Wireless Symposium (RWS),
Li, Xingchen ; Jia, Xiaofan ; Moon, Kyoung-sik... - p. 129-131 , 2023
Link: https://doi.org/10.1109/..
 
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9

Bottom Side Cooling for Glass Interposer with Chip Embeddin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Joon Woo ; Li, Xingchen ; Jia, Xiaofan.. - p. 1609-1613 , 2023
Link: https://doi.org/10.1109/..
 
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10

Antenna-Integrated, Die-Embedded Glass Package for 6G Wirel..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jia, Xiaofan ; Li, Xingchen ; Moon, Kyoung-sik... - p. 377-383 , 2022
Link: https://doi.org/10.1109/..
 
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11

Structural Safety Assessment of Lift Apparatus on Jack-Up B..:

, In: Lecture Notes in Civil Engineering; Practical Design of Ships and Other Floating Structures,
Song, Chang Yong ; Shim, Chun-Sik ; Song, Ha-Cheol... - p. 740-749 , 2020
Link: https://doi.org/10.1007/..
 
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12

32.1 A Behind-The-Ear Patch-Type Mental Healthcare Integrat..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Kim, Hyunjoong ; Kim, Myeongwoo ; Lee, Kwangmuk... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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13

A 145.2dB-DR Baseline-Tracking Impedance Plethysmogram IC f..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Park, Chan Sam ; Kim, Hyunjoong ; Lee, Kwangmuk... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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14

The Optimization of Hollow Hybrid Fin Heat Sinks under Impi..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Effendi, Nico Setiawan ; Park, Jeong Sik ; Kim, Byoung Guk. - p. 413-416 , 2019
Link: https://doi.org/10.1109/..
 
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15

A Heat Transfer Correlation for the Hollow Hybrid Fin Heat ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Effendi, Nico Setiawan ; Park, Jeong Sik ; Kim, Byoung Guk. - p. 236-240 , 2019
Link: https://doi.org/10.1109/..
 
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