Kim, Jung-Hyeon
410  Ergebnisse:
Personensuche X
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1

Reduction of Bubble-Induced Defect in Semiconductor Lithogr..:

, In: IFIP Advances in Information and Communication Technology; Towards AI-Aided Invention and Innovation,
Oh, Kyoung-Whan ; Sasa, Takashi ; Heo, Seok... - p. 493-503 , 2023
 
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2

BANDA: A Novel Blockchain-Assisted Network for Drone Authen..:

, In: 2023 Fourteenth International Conference on Ubiquitous and Future Networks (ICUFN),
 
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3

Misbehavior Detection in Connected Vehicles using BurST-ADM..:

, In: 2022 13th International Conference on Information and Communication Technology Convergence (ICTC),
 
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4

Learning Based Clinical Diagnosis Framework for Inconsisten..:

, In: 2022 Thirteenth International Conference on Ubiquitous and Future Networks (ICUFN),
Jung, Jae-Wook ; Jeon, San-Eun ; Hong, Jun-Pyo... - p. 489-493 , 2022
 
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5

Characterization of the Microstructure of Al–Mg Alloy Matri..:

, In: The Minerals, Metals & Materials Series; Light Metals 2021,
Jung, Jeki ; Kim, Su-Hyeon ; Kim, Won-Kyoung.. - p. 245-249 , 2021
 
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6

Dynamic Simulation of Pacific Island Microgrid with Integra..:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
Lim, Alexandr ; Kim, Yong-Rae ; Kim, Ye-Chan... - p. 1966-1972 , 2023
 
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7

Improvement of Jeju National Museum service using mobile RF..:

, In: Proceedings of the 2nd International Conference on Interaction Sciences: Information Technology, Culture and Human,
Kim, Hyeon-Seok ; Park, Chan Jung ; Kim, Seong Baeg - p. 1066-1071 , 2009
 
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8

Selective Percutaneous Posterolateral Endoscopic Lumbar Nuc..:

, In: Minimally Invasive Percutaneous Spinal Techniques,
Kim, Kyung-Hoon ; Lee, Hyeon-Jung - p. 336-350 , 2010
 
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9

List of Contributors:

, In: Minimally Invasive Percutaneous Spinal Techniques,
Ahn, Yong ; Arias, Carlos F. ; Baek, Seung-Hun... - p. iv-v , 2010
 
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10

Touching Minds: Deep Generative Models Composing the Digita..:

, In: Intelligent Human Computer Interaction; Lecture Notes in Computer Science,
Kim, So Hyeon ; Kim, Ji Hun ; Yang, Jung Ahn.. - p. 106-116 , 2022
 
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11

Built-in Stress effects of IC package substrate's layers on..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Kim, Min-Sung ; Jung, Hyeon-Jun ; Park, Sung-Hoon... - p. 73-76 , 2020
 
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12

Long-term Non-Anesthetic Preclinical Study Available Extra-..:

, In: 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
Lee, Hyungwoo ; Mun, Jun Seung ; San Lee, Jin... - p. 5184-5187 , 2020
 
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13

Development of Laser-Assisted Bonding with Compression (LAB..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
 
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14

Using augmented reality to support observations about trees..:

, In: Proceedings of the 14th International Conference on Interaction Design and Children,
 
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15

Resource Allocation for Minimizing the Transmit Power in Up..:

, In: 2022 13th International Conference on Information and Communication Technology Convergence (ICTC),
Park, Hyun Jung ; Kim, Hyeon Woong ; Chae, Sung Ho - p. 1387-1392 , 2022
 
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