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Kim, Jung-ha
707  Ergebnisse:
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1

Design of failsafe architecture for unmanned ground vehicle:

, In: ICCAS 2010,
Park, Jae-Ung ; Bae, Byung-Hyu ; Lee, Je-Wook. - p. 1101-1104 , 2010
Link: https://doi.org/10.1109/..
 
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2

Research of velocity control on the slope road for Unmanned..:

, In: ICCAS 2010,
Jang, Jae-Hoon ; Bae, Seung-Ho ; Park, Myung-Wook. - p. 1085-1088 , 2010
Link: https://doi.org/10.1109/..
 
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3

The Unmanned Ground Vehicle's local path plan algorithm tha..:

, In: ICCAS 2010,
Lim, Kyung-Il ; Kim, Jae-Hwan ; Kim, Chung-Kyeom. - p. 1097-1100 , 2010
Link: https://doi.org/10.1109/..
 
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4

The research of dynamic network architecture for platooning..:

, In: ICCAS 2010,
Oh, DooYong ; Woo, Hoon Je ; Kim, Jung Ha - p. 1105-1108 , 2010
Link: https://doi.org/10.1109/..
 
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5

Pressureless transient liquid phase sintering bonding using..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hwang, Byeong-Uk ; Min, Kyung Deuk ; Jung, Kwang-Ho... - p. 1855-1860 , 2020
Link: https://doi.org/10.1109/..
 
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6

Temporal Mobile Relay Selection for Information Disseminati..:

, In: 2020 IEEE 17th Annual Consumer Communications & Networking Conference (CCNC),
Roh, Hakgyun ; Kim, Cheonyong ; Kim, Sangdae.. - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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7

SQNR-based Layer-wise Mixed-Precision Schemes with Computat..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Kim, Ha-Na ; Eun, Hyun ; Choi, Jung Hwan. - p. 234-235 , 2022
Link: https://doi.org/10.1109/..
 
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8

LPWA Based Module for Forest Fire Detection:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Jo, Eunsol ; Jung, Cheong-Ha ; Kim, Gu-Sung - p. 167-168 , 2023
Link: https://doi.org/10.23919..
 
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9

Signal Integrity Analysis of IPD Decoupling Capacitor Struc..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Park, Jung-Rae ; Cheong-Ha, Jung ; Kim, Gu-Sung - p. 261-264 , 2022
Link: https://doi.org/10.1109/..
 
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10

Parasitic effect analysis on TSV design factors:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jung, Cheong-Ha ; Seo, Seong Won ; Kim, Gu-Sung - p. 249-251 , 2022
Link: https://doi.org/10.1109/..
 
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11

A study of electromigration effect according to interposer ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Jung, Cheong-Ha ; Park, Jung-Rae ; Seo, Seong Won.. - p. 209-210 , 2022
Link: https://doi.org/10.23919..
 
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12

Stress behavior of solder joint in PET based chip for heter..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Jo, Eunsol ; Jung, Cheong-Ha ; Kim, Gu-Sung - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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13

Stress optimization study about heterogeneous multi-chip st..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Jung, Cheong-Ha ; Seo, Won ; Kim, Gu-sung - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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14

Thermal Stress Tracking in Multi-Die 3D Stacking Structure ..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Jung, Cheong-Ha ; Seo, Won ; Kim, Gu-sung - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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15

Integration of Finite Memory Structure and Unbiased Weighte..:

, In: 2024 IEEE/SICE International Symposium on System Integration (SII),
Lee, Dong Kyu ; Pak, Jung Min ; Kim, Gyun Ha. - p. 1199-1204 , 2024
Link: https://doi.org/10.1109/..
 
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