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Knickerbocker, John U.
9  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Heterogeneous Integration Technology Demonstrations for Fut..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Knickerbocker, John U. ; Budd, R. ; Dang, B.... - p. 1519-1528 , 2018
Link: https://doi.org/10.1109/..
 
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2

Voids-free Die-level Cu/ILD Hybrid bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Polomoff, Nicholas... - p. 800-805 , 2023
Link: https://doi.org/10.1109/..
 
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3

Next Generation Infrared (IR) Laser Debonding / Silicon Han..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Qianwen ; Belyansky, Michael ; Sulehria, Yasir... - p. 1175-1180 , 2023
Link: https://doi.org/10.1109/..
 
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4

Surface Energy Characterization for Die-Level Cu Hybrid Bon..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Belyansky, Michael... - p. 312-316 , 2022
Link: https://doi.org/10.1109/..
 
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5

Thermal solution for Co-Packaged Optics (CPO) modules:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Matsumoto, Keiji ; Farooq, Mukta ; Knickerbocker, John - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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6

Panel Packaging Approach to Micro Thin-film Battery Sealing..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chen, Qianwen ; Dang, Bing ; Pancoast, Leanna... - p. 1560-1565 , 2020
Link: https://doi.org/10.1109/..
 
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7

Flexible Piezoresistive Sensors Fabricated by Spalling Tech..:

, In: 2018 International Flexible Electronics Technology Conference (IFETC),
Sakuma, Katsuyuki ; Hu, Huan ; Bedell, Stephen W.... - p. 1 - 2 , 2018
Link: https://doi.org/10.1109/..
 
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8

More Than Moore - Wafer Scale Integration of Dissimilar Mat..:

, In: 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS),
Kazior, Thomas E. ; LaRoche, Jeffery R. ; Ip, Kelly... - p. 1-1 , 2015
Link: https://doi.org/10.1109/..
 
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9

Face to Face Hybrid Wafer Bonding for Fine Pitch Applicatio..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Fisher, Daniel W. ; Knickerbocker, Sarah ; Smith, Daniel... - p. 595-600 , 2020
Link: https://doi.org/10.1109/..
 
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