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2024 IEEE International Reliability Physics Symposium (IRPS) ,
1
A Unified Physics-Based Stochastic Model for EM-Induced Res..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
2
A Novel Method for the Determination of Electromigration-In..:
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2022 IEEE International Reliability Physics Symposium (IRPS) ,
3
Novel methodology for temperature-aware electromigration as..:
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Proceedings of the 2024 International Symposium on Physical Design ,
4
Warpage Study by Employing an Advanced Simulation Methodolo..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
5
Electromigration Test Chip Experiments from Realistic Power..:
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Proceedings of the 2023 International Symposium on Physical Design ,
6
Electromigration Assessment in Power Grids with Account of ..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
7
Studying the Impact of Temperature Gradient on Electromigra..:
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Proceedings of the 2022 International Symposium on Physical Design ,
8
Novel Methodology for Assessing Chip-Package Interaction Ef..:
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2019 International 3D Systems Integration Conference (3DIC) ,
9
An Accurate Assessment of Chip-Package Interaction is a Key..:
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2009 10th International Symposium on Quality Electronic Design ,
10