Kteyan, A.
10  Ergebnisse:
Personensuche X
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1

A Unified Physics-Based Stochastic Model for EM-Induced Res..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Sukharev, V. ; Choy, J.-H. ; Kteyan, A.... - p. 1-10 , 2024
 
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2

A Novel Method for the Determination of Electromigration-In..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Shuster-Passage, J. ; Razek, S. Abdel ; Mattoo, M.... - p. 10A.4-1-10A.4-6 , 2024
 
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3

Novel methodology for temperature-aware electromigration as..:

, In: 2022 IEEE International Reliability Physics Symposium (IRPS),
Kteyan, A. ; Sukharev, V. ; Yi, Y.. - p. 1-10 , 2022
 
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4

Warpage Study by Employing an Advanced Simulation Methodolo..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
 
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5

Electromigration Test Chip Experiments from Realistic Power..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Yi, Yong Hyeon ; Kim, Chris ; Kteyan, Armen... - p. 01-06 , 2024
 
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6

Electromigration Assessment in Power Grids with Account of ..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
 
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7

Studying the Impact of Temperature Gradient on Electromigra..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Yi, Yong Hyeon ; Kim, Chris ; Zhou, Chen.. - p. 1-5 , 2023
 
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8

Novel Methodology for Assessing Chip-Package Interaction Ef..:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Kteyan, Armen ; Choy, Jun-Ho ; Sukharev, Valeriy... - p. 83-89 , 2022
 
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9

An Accurate Assessment of Chip-Package Interaction is a Key..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
 
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10

Control of design specific variation in etch-assisted via p..:

, In: 2009 10th International Symposium on Quality Electronic Design,
 
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