Ku, Chee Wai
97  Ergebnisse:
Personensuche X
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6

MuMMI : multiple metrics modeling infrastructure for exp..:

, In: Proceedings of the Conference on Extreme Science and Engineering Discovery Environment: Gateway to Discovery,
 
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7

Support for adaptivity in ARMCI using migratable objects:

, In: Proceedings of the 20th international conference on Parallel and distributed processing,
 
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8

Industry Drop Tests in Solder Joint Reliability Study of Mo..:

, In: 2006 International Conference on Electronic Materials and Packaging,
Ong, Kang Eu ; Loh, Wei Keat ; Wong, Chee Wai... - p. None , 2006
 
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9

Hong Kong's Insurance Industry in Response to COVID-19:

, In: LCF Studies in Commercial and Financial Law; Quo vadis Commercial Contract?,
Wong, Chee Wai Terry ; Tsui, Tat Chee - p. 233-249 , 2023
 
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10

Effect of Solder Voids on Chip Crack during Al Ribbon Bondi..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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11

The Survival of the Unfit:

, In: After Darwin,
Dimock, Wai Chee - p. 121-134 , 2022
 
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13

Simulation of Wire Bond Clamping and Its effect on Die Pad ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Tan, Lay Tatt ; Tan, Wee Kien ; Wai, Chee Mun - p. 566-569 , 2019
 
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15

Secure Recognition of Voice-Less Commands Using Videos:

, In: Communications in Computer and Information Science; Global E-Security,
 
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