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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
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The Geochemical Characteristics and Oil Source Correlation ..:
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Diagnostic Imaging of Drug Resistant Pulmonary Tuberculosis ,
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Multidrug-Resistant Tuberculosis:
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2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) ,
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Correlations between Static Noise Margin and Single-Event-U..:
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Advances in Experimental Medicine and Biology; Cell Biology and Translational Medicine, Volume 21 ,
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Mesenchymal Stem Cells: A Promising Treatment for Thymic In..:
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2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
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Improving Interface State Density of TiN/HfO2/IL Gate Stack..:
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2019 IEEE 9th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems (CYBER) ,
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Optimizing FPGA-based Convolutional Encoder-Decoder Archite..:
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2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) ,
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ab initio simulation on mono-layer MoS2 tunnel FET: Impact ..:
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2008 International Conference on MultiMedia and Information Technology ,
8
Discussion on Minimizing File Access Privilege:
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2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
9
Interface Treatment of Epitaxial SI FINFET Channel in Repla..:
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Proceedings of the 22nd Annual International Conference on Mobile Systems, Applications and Services ,
10
UWB-Fi: Pushing Wi-Fi towards Ultra-wideband for Fine-Granu..:
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The Minerals, Metals & Materials Series; Characterization of Minerals, Metals, and Materials 2024 ,
11
Phosphoric Acid Leaching of Ni–Co–Fe Powder Derived from Li..:
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2024 7th International Conference on Energy, Electrical and Power Engineering (CEEPE) ,
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Review of HTRB and HTGB Reliability of SiC MOSFETs:
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2024 7th International Conference on Energy, Electrical and Power Engineering (CEEPE) ,
13
Review of Reliability of Silicon Carbide Power Diodes:
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2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
14
Improvement of Line Roughness of Fin by Conventional Therma..:
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2023 IEEE International Conference on Data Mining (ICDM) ,
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