Lai, Chieh Min Benjamin
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18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format..:

, In: 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers,
Ju, Chi-Cheng ; Liu, Tsu-Ming ; Lee, Kun-Bin... - p. 1-3 , 2015
 
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Density-aware Detailed Placement with Instant Legalization:

, In: Proceedings of the 51st Annual Design Automation Conference,
 
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Density-aware detailed placement with instant legalization:

, In: 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC),
 
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Simulation of Reflection Noise in Small Single-end Serpenti..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
 
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