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2020 IEEE International Conference on Consumer Electronics (ICCE) ,
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Multi-modal Sensor Module for Outdoor Robots:
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2007 26th International Conference on Thermoelectrics ,
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New metallic substrates for high thermal efficient TEC:
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2022 International Conference on Platform Technology and Service (PlatCon) ,
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Applicability Analysis of Knowledge Graph Embedding on Blen..:
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Proceedings 2000. Design Automation Conference. (IEEE Cat. No.00CH37106) ,
4
A 12b 50 MHz 3.3 V CMOS acquisition time minimized A/D conv..:
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2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
5
A 900V HVIC Process with New Structure of Internal Bootstra..:
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Lecture Notes in Electrical Engineering; Information Science and Applications ,
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Image Background Subtraction and Partial Stylization Based ..:
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Proceedings of the 2nd International Symposium on Computer Science and Intelligent Control ,
7
Development of CoAP-based IoT Communication System for Smar..:
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Proceedings of the 2000 Asia and South Pacific Design Automation Conference ,
9
A 12b 50 MHz 3.3V CMOS acquisition time minimized A/D conve..:
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Data Assimilation for Atmospheric, Oceanic and Hydrologic Applications (Vol. IV) ,
10
An Overview of KMA's Operational NWP Data Assimilation Syst..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
11
Growth kinetics of intermetallic compound layers at the int..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
12
Pressureless transient liquid phase sintering bonding using..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Thermomechanical Properties of Fan-Out Wafer Level Package ..:
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2007 IEEE International Symposium on Circuits and Systems (ISCAS) ,
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