Lee, Gi Young
178  Ergebnisse:
Personensuche X
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1

Low-Power GaAs ICs:

, In: ESSCIRC '85: 11th European Solid-State Circuits Conference,
Vu, Tho T. ; Jamison, Stephen A. ; Lee, Gary M.... - p. 385-389 , 1985
 
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2

Transformer Design Considering Fringing Effect for High Fre..:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
Yang, Jong-Uk ; Lee, Gi-Young ; Kim, Rae-Young - p. 323-328 , 2023
 
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3

Exploring Replacement Policy for Memcached:

, In: 2020 International SoC Design Conference (ISOCC),
Lee, Gi ; Kim, Byoung Jin ; Chung, Eui-Young - p. 296-297 , 2020
 
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4

Effects of thermo-compression bonding parameters on joint f..:

, In: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC),
Shin, Ji-Won ; Kim, Young Soon ; Lee, Hyoung Gi... - p. 910-915 , 2015
 
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5

A 0.35 μm SiGe BiCMOS 8 GHz Low Noise Broad Band Amplifier:

, In: Proceedings of the IEEE SoutheastCon 2006,
Young Gi Kim ; Eun Jin Lee ; Chang Woo Kim... - p. 224,225,226,227 , 2006
 
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6

Spatial Behavior Data in Virtual Conference: Proximity and ..:

, In: Cultural Space on Metaverse; KAIST Research Series,
Lee, Gi-bbeum ; Chang, Mi ; Yun, Ji-Young. - p. 133-145 , 2023
 
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7

Evaluation of Slotless Permanent Synchronous Motor with Tor..:

, In: 2019 IEEE Energy Conversion Congress and Exposition (ECCE),
Lee, Ho-Young ; Lee, Eui-Chun ; Lee, Gi-Ju. - p. 1735-1738 , 2019
 
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8

List of Contributors:

, In: Buckwheat Germplasm in the World,
Adachi, Taiji ; Akulov, Anton N. ; Baviello, Gerardo... - p. xv-xviii , 2018
 
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11

Impact of Current induced Joule heating variation on long-t..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Tae-Kyu ; Park, Yujin ; Ramakrishna, Gnyaneshwar... - p. 1439-1444 , 2024
 
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12

Improvement of HCI and HTRB Reliability on 100V pLDMOS for ..:

, In: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Park, Dong-Hoon ; Kim, Min-Woo ; Min, Jun-Ki.. - p. 270-273 , 2023
 
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13

Effect of Bio-based Epoxy Resins on the Thermal, Mechanical..:

, In: 2022 6th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST),
Cho, Han-Goo ; Hong, Young-Gi ; Noh, Yo-Han.. - p. 271-274 , 2022
 
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14

Effect of Package Pick and Place Process to Induce Chip Cra..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lee, Jong-Gi ; Kim, Bo-Sung ; Kang, Tae Ho. - p. 101-103 , 2020
 
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15

2B-SSD : the case for dual, byte- and block-addressable ..:

, In: Proceedings of the 45th Annual International Symposium on Computer Architecture,
Bae, Duck-Ho ; Jo, Insoon ; Choi, Youra Adel... - p. 425-438 , 2018
 
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