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Lee, Keunsoo
9  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Contributors:

, In: Combustion Chemistry and the Carbon Neutral Future,
Abraham, Abhinav ; Alam, Mahabubul ; Babu, Aravindh... - p. xv-xix , 2023
Link: https://doi.org/10.1016/..
 
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2

Bio-derived sustainable aviation fuels—On the verge of powe..:

, In: Combustion Chemistry and the Carbon Neutral Future,
Tomar, Mukul ; Abraham, Abhinav ; Kim, Keunsoo... - p. 521-598 , 2023
Link: https://doi.org/10.1016/..
 
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3

The Simulation Study on the Effect of Transmission Error in..:

, In: 2023 14th International Conference on Information and Communication Technology Convergence (ICTC),
Lee, Jaewook ; Ko, Keunsoo ; Ko, Haneul - p. 889-891 , 2023
Link: https://doi.org/10.1109/..
 
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4

BMBC: Bilateral Motion Estimation with Bilateral Cost Volum..:

, In: Computer Vision – ECCV 2020; Lecture Notes in Computer Science,
Park, Junheum ; Ko, Keunsoo ; Lee, Chul. - p. 109-125 , 2020
Link: https://doi.org/10.1007/..
 
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5

Virtual thread : maximizing thread-level parallelism bey..:

, In: Proceedings of the 43rd International Symposium on Computer Architecture,
Yoon, Myung Kuk ; Kim, Keunsoo ; Lee, Sangpil.. - p. 609-621 , 2016
Link: https://dl.acm.org/doi/1..
 
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6

Warped-compression : enabling power efficient GPUs throu..:

, In: Proceedings of the 42nd Annual International Symposium on Computer Architecture,
Lee, Sangpil ; Kim, Keunsoo ; Koo, Gunjae... - p. 502-514 , 2015
Link: https://dl.acm.org/doi/1..
 
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7

A network-adaptive SVC Streaming Architecture:

, In: The 9th International Conference on Advanced Communication Technology,
Chen, Peng ; Lim, Jeongyeon ; Lee, Bumshik... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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8

The effect of microvia-in-pads design on SMT defects in ult..:

, In: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,
Yong-Won Lee ; Keun-Soo Kim ; Suganuma, Katsuaki - p. 870-875 , 2010
Link: https://doi.org/10.1109/..
 
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9

Developing the stencil printing process for 01005 lead-free..:

, In: 2008 International Conference on Electronic Packaging Technology & High Density Packaging,
Yong-Won Lee ; Keun-Soo Kim ; Katsuaki Suganuma. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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