E-LIB Suche - Ergebnisse für: Leiming, Du

1

Investigating Mechanical Properties of Silicon Carbide Coat..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),

Mo, Jiarui ; Schaffar, Gerald J.K. ; Du, Leiming... - p. 626-629 , 2024

Link: https://doi.org/10.1109/..

2

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Ji, Xinrui ; Du, Leiming ; van Zeijl, Henk... - p. 1891-1895 , 2024

Link: https://doi.org/10.1109/..

3

Multi-parameters optimization for electromigration in WLCSP..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

Du, Leiming ; Deng, Shanliang ; Cui, Zhen... - p. 1-4 , 2024

Link: https://doi.org/10.1109/..

4

High-temperature creep properties of a novel solder materia..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Du, Leiming ; Zhao, Xiujuan ; Poelma, Rene.. - p. 392-395 , 2023

Link: https://doi.org/10.1109/..

5

Low Temperature Fine Pitch All-Copper Interconnects Combini..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Ji, Xinrui ; Van Zeijl, Henk ; Jiao, Weiping... - p. 1237-1243 , 2023

Link: https://doi.org/10.1109/..

6

Micro-cantilever Bending Test of Sintered Cu nanoparticles ..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

Du, Leiming ; Hu, Dong ; Poelm, Rene.. - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

7

Investigation of Potting Compounds on Thermal-Fatigue prope..:

, In: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society,

Du, Leiming ; Zhao, Xiujuan ; Watte, Piet... - p. 1-5 , 2022

Link: https://doi.org/10.1109/..